FIG. 1 is a perspective view of a material having an edge shape, showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having an edge shape of FIG. 1, taken along lines 2-2 in FIG. 1;
FIG. 3 is a top plan view of the material having an edge shape of FIG. 1;
FIG. 4 is a right side elevation view of the material having an edge shape of FIG. 1; and,
FIG. 5 is a left side elevation view of the material having an edge shape of FIG. 1.
The broken lines in FIGS. 1-7 illustrate portions of the material having an edge shape that form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
4058537, |
Jan 05 1976 |
Ciba-Geigy Corporation |
Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols |
4199490, |
May 07 1974 |
Asahi Kasei Kogyo Kabushiki Kaisha |
Block copolymer latex composition |
4678115, |
Apr 15 1985 |
Ontario Technologies Corporation |
Method for making layered foil structure |
4863551, |
Aug 10 1987 |
YKK Corporation |
Marking apparatus |
5700340, |
Oct 22 1993 |
YKK Corporation |
Method of manufacturing a tape having a succession of surface-type fastener pieces |
5943557, |
Sep 25 1996 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method and structure for attaching a semiconductor die to a lead frame |
6391686, |
Jun 14 1999 |
Seiko Epson Corporation |
Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument |
6696639, |
Jun 24 1999 |
RPX Corporation |
Protecting device against interfering electromagnetic radiation comprising EMI-gaskets |
6987671, |
Jun 26 2003 |
Intel Corporation |
Composite thermal interface devices and methods for integrated circuit heat transfer |
7004244, |
Jun 07 2001 |
Henkel IP & Holding GmbH |
Thermal interface wafer and method of making and using the same |
7229683, |
May 30 2003 |
3M Innovative Properties Company |
Thermal interface materials and method of making thermal interface materials |
7488900, |
Sep 22 2006 |
LAIRD TECHNOLOGIES, INC |
Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding |
7821126, |
Mar 31 2003 |
Intel Corporation |
Heat sink with preattached thermal interface material and method of making same |
7906845, |
Apr 23 2008 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor |
8445102, |
Nov 05 2007 |
Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC |
Thermal interface material with thin transfer film or metallization |
8545987, |
Nov 05 2007 |
Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC |
Thermal interface material with thin transfer film or metallization |
8916419, |
Mar 29 2012 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lid attach process and apparatus for fabrication of semiconductor packages |
8920919, |
Sep 24 2012 |
Intel Corporation |
Thermal interface material composition including polymeric matrix and carbon filler |
9016629, |
Nov 28 2011 |
The Boeing Company |
Combined pressure and thermal window system for space vehicles |
9089044, |
Apr 04 2014 |
Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC |
EMI shielding connector gasket |
9257364, |
Jun 27 2012 |
Intel Corporation |
Integrated heat spreader that maximizes heat transfer from a multi-chip package |
9316447, |
Mar 22 2012 |
SIGNIFY HOLDING B V |
Thermal interface material |
9330998, |
Apr 18 2014 |
Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC |
Thermal interface material assemblies and related methods |
9418912, |
Dec 21 2012 |
Intel Corporation |
Methods of forming serpentine thermal interface material and structures formed thereby |
9472485, |
Aug 29 2012 |
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED |
Hybrid thermal interface material for IC packages with integrated heat spreader |
20030037866, |
|
|
|
20030234322, |
|
|
|
20040180474, |
|
|
|
20040188814, |
|
|
|
20040261980, |
|
|
|
20040262372, |
|
|
|
20040262743, |
|
|
|
20070193672, |
|
|
|
20090000818, |
|
|
|
20140367847, |
|
|
|
20160160104, |
|
|
|
20160185074, |
|
|
|
20160315030, |
|
|
|
20160326419, |
|
|
|
20160355249, |
|
|
|
20160362169, |
|
|
|
114239, |
|
|
|
D344489, |
Nov 04 1991 |
Texstar, Inc. |
Fairing seal for aircraft canopy |
D348387, |
Sep 21 1990 |
The Serco Corporation |
Loading dock seal |
D644757, |
Oct 06 2009 |
Elematic Group Oy |
Chamfer strip |
D690272, |
May 05 2011 |
Laird Technologies, Inc.; LAIRD TECHNOLOGIES, INC |
Profile for a co-extrusion |
D707185, |
May 05 2011 |
LAIRD TECHNOLOGIES, INC |
Profile for a co-extrusion |
D728773, |
May 08 2012 |
LAIRD TECHNOLOGIES, INC |
Vent panel |
D731078, |
Jul 25 2013 |
|
Transition strip |
D734732, |
Jul 10 2013 |
Sumitomo Electric Fine Polymer, Inc.; Sumitomo Electric Printed Circuits, Inc. |
Circuit board material |
D807531, |
Jan 21 2014 |
YU SEAL LIMITED |
Flexible seal |
D862404, |
Oct 25 2016 |
DAIKIN FINETECH, LTD |
Sealing material ring for a semiconductor manufacturing apparatus |
EP2814057, |
|
|
|
JP2005327923, |
|
|
|
JP2010235953, |
|
|
|
JP2012084688, |
|
|
|
KR100827725, |
|
|
|
WO2016182996, |
|
|
|
WO9741599, |
|
|
|