FIG. 1 is a perspective view of a seal member for semiconductor production apparatus, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a cross-sectional view thereof taken along line 8-8 shown in FIG. 6; and,
FIG. 9 is an enlarged cross-sectional view of a portion thereof taken from area 9-9 shown in FIG. 8.
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