The ornamental design for seal member for use in semiconductor production apparatus, as shown and described.
1.-4. Seal members for use in semiconductor production apparatus
1.1 : Perspective
1.2 : Front
1.3 : Back
1.4 : Left
1.5 : Right
1.6 : Top
1.7 : Bottom
1.8 : Cross-sectional
1.9 : Partial enlargement of cross-sectional
1.10 : Reference
2.1 : Perspective
2.2 : Front
2.3 : Back
2.4 : Left
2.5 : Right
2.6 : Top
2.7 : Bottom
2.8 : Cross-sectional
2.9 : Partial enlargement of cross-sectional
2.10 : Reference
3.1 : Perspective
3.2 : Front
3.3 : Back
3.4 : Left
3.5 : Right
3.6 : Top
3.7 : Bottom
3.8 : Cross-sectional
3.9 : Partial enlargement of cross-sectional
3.10 : Reference
4.1 : Perspective
4.2 : Front
4.3 : Back
4.4 : Left
4.5 : Right
4.6 : Top
4.7 : Bottom
4.8 : Cross-sectional
4.9 : Partial enlargement of cross-sectional
4.10 : Reference
The present articles are seal members for semiconductor production apparatuses such as chemical vapor deposition apparatuses and dry etching apparatuses; as illustrated in the reproductions 1.10, 2.10, 3.10 and 4.10, each article is to be inserted into grooves of a semiconductor production apparatus; the semiconductor production apparatuses themselves form no part of the claimed designs; the reproductions 1.8, 2.8, 3.8 and 4.8 show transverse cross-sectional front views taken along the horizontal centers of the reproductions 1.6, 2.6, 3.6 and 4.6, respectively; the reproductions 1.9, 2.9, 3.9 and 4.9 are enlarged views showing left end portions of the cross-sectional views 1.8, 2.8, 3.8 and 4.8, respectively.