Patent
   D786807
Priority
Sep 19 2014
Filed
Dec 11 2015
Issued
May 16 2017
Expiry
May 16 2032
Assg.orig
Entity
unknown
10
35
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of a heat sink depicting an embodiment of our new design;

FIG. 2 is an opposite perspective view thereof;

FIG. 3 is a front devotional view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view of a heat sink depicting a second embodiment our new design;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a rear elevational view thereof;

FIG. 12 is a left side elevational view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a top plan view thereof; and,

FIG. 15 is a bottom plan view thereof.

The broken lines indicate unclaimed portions and form no part of the claimed design.

Murphy, Mark Allen, Jiang, Aiqin, Kharshikar, Satish Dattatray, Kanetkar, Sachin Vrajalal

Patent Priority Assignee Title
D795807, Sep 16 2015 Mitsubishi Electric Corporation Cover of AC generator for vehicle
D819579, Jul 22 2016 Heat sink
D820785, Sep 16 2015 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
D823252, Sep 16 2015 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
D827589, Apr 05 2016 SUMITOMO SEIKA CHEMICALS CO , LTD Heat sink
D833988, Jul 22 2016 Heat sink
D849566, Dec 21 2016 MECALC (PTY) LIMITED Electronic instruments casing
D849567, Dec 21 2016 MECALC (PTY) LIMITED Electronic instruments casing
D880436, Nov 15 2018 RB Distribution, Inc. Heat sink for a control module
ER4438,
Patent Priority Assignee Title
5323845, May 17 1993 Heat sink clip assembly
5368094, Nov 02 1993 Bipartite heat sink positioning device for computer chips
5430610, Jun 15 1994 Separable positioning device for the heat sink on computer chips
5574626, Jul 12 1995 Unisys Corporation Add-on heat sink
5678627, Jan 03 1996 CPU heat sink mounting structure
5724228, Aug 14 1996 CPU heat dissipator
5829512, Aug 29 1995 Hewlett Packard Enterprise Development LP Heatsink and method of forming a heatsink
6161611, Jul 09 1999 Asai Vital Components Co., Ltd. Radiator
6459583, Jul 05 2000 Hon Hai Precision Ind. Co., Ltd. Ready-to-mount heat dissipating assembly
6470962, Aug 24 2001 Infortrend Technology Inc. Retaining tool of heat radiator
6560111, Dec 28 2001 Fang Tien, Huang Bracket for CPU cooler
6621704, Apr 18 2002 Hon Hai Precision Ind. Co., Ltd. Clip for heat sink
7006353, Mar 11 2004 International Business Machines Corporation Apparatus and method for attaching a heat sink to an integrated circuit module
7040384, Jan 27 2004 Molex Incorporated Heat dissipation device
7391615, Oct 10 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Clip for heat sink
7447020, Aug 12 2005 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD Heat sink assembly
7532468, Sep 27 2006 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. Heat sink having high heat dissipation efficiency
7815316, Sep 28 2007 Hon Hai Precision Industry Co., Ltd. Projector having digital micromirror device with thermoelectric cooling chip attached thereto
8498116, Jul 16 2010 Rockwell Automation Technologies, Inc. Heat sink for power circuits
8498118, Oct 27 2010 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. Mounting assembly for heat dissipating device
8780563, Dec 12 2011 Rockwell Automation Technologies, Inc. Load distributed heat sink system
20050072555,
20080011451,
D453744, May 11 2001 Foxconn Precision Components Co., Ltd. Heat sink
D465462, Jul 24 2001 Base for a heat dissipating assembly
D474754, Jul 15 2002 Delta Electronics Inc. Heat sink
D481017, Sep 13 2002 Delta Electronics Inc. Heat sink
D492265, Apr 24 2003 Datech Technology Co., Ltd. Thermal efficient heat sink for electronic devices
D529873, May 14 2005 Foxconn Technology Co., Ltd. Heat sink
D672322, Dec 28 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D672728, Dec 28 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D672729, Dec 30 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D672730, Mar 13 2012 Foxsemicon Integrated Technology, Inc. Heat sink
D698740, May 23 2012 Alpoint Technologies, LLC Heat sink
D747278, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 16 2014MURPHY, MARK ALLENGeneral Electric CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377870673 pdf
Sep 17 2014KHARSHIKAR, SATISH DATTATRAYGeneral Electric CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377870673 pdf
Sep 17 2014KANETKAR, SACHIN VRAJALALGeneral Electric CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377870673 pdf
Sep 18 2014JIANG, AIQINGeneral Electric CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377870673 pdf
Dec 11 2015General Electric Company(assignment on the face of the patent)
Nov 01 2018General Electric CompanyGE GLOBAL SOURCING LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0488910130 pdf
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