Patent
   D672322
Priority
Dec 28 2011
Filed
Dec 28 2011
Issued
Dec 11 2012
Expiry
Dec 11 2026
Assg.orig
Entity
unknown
4
11
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of a heat sink of my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showing of the heat sink is for illustrative purposes only and forms no part of the claimed design.

Lin, Chu-Keng

Patent Priority Assignee Title
D747278, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
D755740, Jul 14 2014 HANGZHOU HPWINNER OPTO CORPORATION Heat sink
D786807, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
D918160, Jan 14 2020 ALL BEST PRECISION TECHNOLOGY CO., LTD. Heat sink
Patent Priority Assignee Title
6702003, May 31 2002 QUANTA COMPUTER INC. Three-phase heat transfer structure
7275587, Jan 20 2006 Combination cooler module
7515424, Mar 30 2007 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device having metal die-casting component and metal-extrusion component
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D367469, Sep 19 1994 Motorola, Inc Heat sink
D379799, Sep 19 1994 MOTOROLA SOLUTIONS, INC Heat sink
D573110, Jul 27 2007 NIDEC CORPORATION Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 20 2011LIN, CHU-KENGFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274490264 pdf
Dec 28 2011Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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