Patent
   D573110
Priority
Jul 27 2007
Filed
Jul 27 2007
Issued
Jul 15 2008
Expiry
Jul 15 2022
Assg.orig
Entity
unknown
17
23
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a front elevation view of a heat sink according to our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is another perspective view thereof.

Otsuki, Takaya, Yamashita, Takamasa, Hirakawa, Akira

Patent Priority Assignee Title
10021811, May 24 2016 ASETEK DANMARK A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
9867315, Jun 29 2012 ASETEK DANMARK A/S Server memory cooling apparatus
D672322, Dec 28 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D672728, Dec 28 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D672730, Mar 13 2012 Foxsemicon Integrated Technology, Inc. Heat sink
D698740, May 23 2012 Alpoint Technologies, LLC Heat sink
D715748, Nov 26 2013 Heatscape, Inc. Inverted floating core heat sink
D717745, Dec 01 2011 Alpoint Technologies, LLC Heat sink
D795821, Feb 22 2016 Heatscape.com, Inc. Liquid cooling cold plate with diamond cut pin fins
D800674, May 24 2016 ASETEK DANMARK A/S; ASETEK DANMARK A S Cooling plate row for in-line memory
D800675, May 24 2016 ASETEK DANMARK A/S; ASETEK DANMARK A S Set of cooling plate rows for in-line memory
D803169, Feb 22 2016 Heatscape.com, Inc. Combined liquid cooling cold plate and vapor chamber
D804434, Jun 15 2016 Adda Corp. Electronic component heatsink assembly
D819579, Jul 22 2016 Heat sink
D829673, Feb 22 2016 Heatscape.com, Inc. Combined liquid cooling cold plate and vapor chamber
D833988, Jul 22 2016 Heat sink
D924186, Mar 09 2020 CAMBRICON TECHNOLOGIES CORPORATION LIMITED Board card
Patent Priority Assignee Title
5519574, Jan 20 1994 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
6269864, Feb 18 2000 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
6411510, Feb 08 2000 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
6470962, Aug 24 2001 Infortrend Technology Inc. Retaining tool of heat radiator
6480383, Sep 29 2000 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
6480387, Mar 14 2002 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
6621704, Apr 18 2002 Hon Hai Precision Ind. Co., Ltd. Clip for heat sink
6976525, Feb 24 2004 Asia Vital Component Co., Ltd. Fastening device for a radiator
20030121643,
20050072558,
20060056159,
20070074857,
20070277957,
D465462, Jul 24 2001 Base for a heat dissipating assembly
D465771, Jul 24 2001 Heat dissipating assembly
D474754, Jul 15 2002 Delta Electronics Inc. Heat sink
D481017, Sep 13 2002 Delta Electronics Inc. Heat sink
JP1091315,
JP1091551,
JP1091552,
JP1168617,
JP1168855,
JP1205085,
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 21 2007OTSUKI, TAKAYANIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230468 pdf
Jul 21 2007YAMASHITA, TAKAMASANIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230468 pdf
Jul 21 2007HIRAKAWA, AKIRANIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230468 pdf
Jul 27 2007NIDEC CORPORATION(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule