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Patent
D715748
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Priority
Nov 26 2013
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Filed
Nov 26 2013
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Issued
Oct 21 2014
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Expiry
Oct 21 2028
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Assg.orig
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Entity
unknown
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1
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13
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n/a
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The ornamental design for an inverted floating core heat sink, as shown and described.
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FIG. 1 is a top perspective view of an inverted floating core heat sink showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged left side elevational view thereof;
FIG. 8 is an enlarged right side elevational view thereof;
FIG. 9 is a top perspective view of the inverted floating core heat sink disassembled from a generic circuit board;
FIG. 10 is a bottom perspective view corresponding to FIG. 9; and,
FIG. 11 shows a top perspective view of the inverted floating core heat sink assembled with a generic circuit board.
The generic circuit boards and the modules shown FIGS. 9-11 form no part of the claimed design.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Mira, Ali, Mira, Yashar, Mira, Michael
Patent |
Priority |
Assignee |
Title |
D977488, |
May 29 2021 |
|
Heat sink |
Patent |
Priority |
Assignee |
Title |
5969949, |
Mar 31 1998 |
Oracle America, Inc |
Interfitting heat sink and heat spreader slug |
6407445, |
Oct 06 2000 |
National Semiconductor Corporation |
MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink |
7625223, |
Oct 01 2008 |
Tyco Electronics Corporation |
Connector system with floating heat sink |
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Oct 21 2009 |
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. |
Printed circuit board assembly |
8289699, |
Sep 21 2010 |
Foxconn Technology Co., Ltd. |
Heat dissipation module and electronic device having the same |
8724326, |
Dec 16 2011 |
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. |
Heat dissipation structure |
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20060056153, |
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20120300401, |
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20140111939, |
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D573110, |
Jul 27 2007 |
NIDEC CORPORATION |
Heat sink |
D589003, |
Feb 15 2008 |
Delta Electronics Inc. |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a