Patent
   D465771
Priority
Jul 24 2001
Filed
Jul 24 2001
Issued
Nov 19 2002
Expiry
Nov 19 2016
Assg.orig
Entity
unknown
9
8
n/a
The ornamental design for a heat dissipating assembly, as shown.

FIG. 1 is a perspective view of a heat dissipating assembly, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Hsieh, Hsin-Mao

Patent Priority Assignee Title
D573110, Jul 27 2007 NIDEC CORPORATION Heat sink
D575242, Apr 05 2006 NIDEC CORPORATION Fan
D576567, Feb 13 2007 NIDEC CORPORATION Heat sink fan
D637979, Jul 29 2010 Lien Chang Electronic Enterprise Co., Ltd. Coil rack
D638807, Jul 29 2010 Lien Chang Electronic Enterprise Co., Ltd. Coil rack
D829183, Jun 15 2017 SHENZHEN GAOYU ELECTRONIC TECHNOLOGY CO., LTD. Graphic card radiator
ER5136,
ER8598,
ER8791,
Patent Priority Assignee Title
5368094, Nov 02 1993 Bipartite heat sink positioning device for computer chips
5486980, Mar 30 1993 Aavid Thermalloy, LLC Method and apparatus for dissipating thermal energy
5495392, Mar 06 1995 CPU heat dissipating apparatus
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