Patent
   D576567
Priority
Feb 13 2007
Filed
Jul 27 2007
Issued
Sep 09 2008
Expiry
Sep 09 2022
Assg.orig
Entity
unknown
2
38
n/a
The ornamental design for a heat sink fan, as shown and described.

FIG. 1 is a front elevation view of a heat sink fan according to our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

Otsuki, Takaya, Yamashita, Takamasa, Yamaoka, Naoto

Patent Priority Assignee Title
7607887, Dec 15 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Fan frame
D905223, Oct 12 2018 EBM-PAPST Mulfingen GmbH & Co. KG Axial fan for transportation
Patent Priority Assignee Title
5794685, Dec 17 1996 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Heat sink device having radial heat and airflow paths
6407919, Dec 18 2000 Structure of computer CPU heat dissipation module
6419007, Mar 30 2001 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
6671172, Sep 10 2001 Micron Technology, Inc Electronic assemblies with high capacity curved fin heat sinks
6714415, Mar 13 2003 Intel Corporation Split fin heat sink
6779593, Apr 30 2003 Hewlett Packard Enterprise Development LP High performance cooling device with heat spreader
7123483, Dec 26 2003 NIDEC CORPORATION Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan
7142426, Aug 13 2004 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipating device and method for manufacturing it
7221567, Apr 12 2004 NIDEC CORPORATION Heat sink fan
7362573, Apr 28 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device
20020017378,
20020046826,
20050141992,
20050271506,
20060126303,
20060219386,
D465771, Jul 24 2001 Heat dissipating assembly
D490348, Aug 22 2001 CAVEY, JOHN DAVID; CAVEY, PAMELA ANNE Shinguard
D501450, Jun 10 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D509484, Dec 09 2003 Fujikura Ltd. Heat sink
D509485, Dec 09 2003 Fujikura Ltd. Heat sink
D511326, Jun 25 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D516526, Jun 25 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D541229, May 13 2004 SANYO DENKI CO LTD Electronic component cooling apparatus
D561120, Sep 28 2006 Delta Electronics, Inc. Heat dissipating module
D561121, Jan 30 2007 Fujikura Ltd Heat sink
D561122, Jan 30 2007 Fujikura Ltd Heat sink
D564460, Jan 25 2007 NIDEC CORPORATION Heat sink fan
JP1188537,
JP1222196,
JP1237688,
JP1237951,
JP1237952,
JP1237953,
JP1295760D,
JP1296655D,
TW118870,
TW118994,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 20 2007OTSUKI, TAKAYANIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230454 pdf
Jul 20 2007YAMASHITA, TAKAMASANIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230454 pdf
Jul 20 2007YAMAOKA, NAOTONIDEC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0196230454 pdf
Jul 27 2007NIDEC CORPORATION(assignment on the face of the patent)
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