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Patent
D564460
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Priority
Jan 25 2007
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Filed
Jan 25 2007
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Issued
Mar 18 2008
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Expiry
Mar 18 2022
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Assg.orig
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Entity
unknown
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5
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28
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n/a
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The ornamental design for a heat sink fan, as shown and described.
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FIG. 1 is a front elevation view of a heat sink fan showing our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
Otsuki, Takaya, Yamashita, Takamasa, Inouchi, Kazuhiro
| Patent |
Priority |
Assignee |
Title |
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Dec 17 1996 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Heat sink device having radial heat and airflow paths |
| 6407919, |
Dec 18 2000 |
|
Structure of computer CPU heat dissipation module |
| 6419007, |
Mar 30 2001 |
Sanyo Denki Co., Ltd. |
Heat sink-equipped cooling apparatus |
| 6671172, |
Sep 10 2001 |
Micron Technology, Inc |
Electronic assemblies with high capacity curved fin heat sinks |
| 6714415, |
Mar 13 2003 |
Intel Corporation |
Split fin heat sink |
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Apr 30 2003 |
Hewlett Packard Enterprise Development LP |
High performance cooling device with heat spreader |
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Dec 26 2003 |
NIDEC CORPORATION |
Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan |
| 7221567, |
Apr 12 2004 |
NIDEC CORPORATION |
Heat sink fan |
| 20020017378, |
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| 20020046826, |
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| 20020182068, |
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| 20050141992, |
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Jun 10 2003 |
Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
| D509484, |
Dec 09 2003 |
Fujikura Ltd. |
Heat sink |
| D509485, |
Dec 09 2003 |
Fujikura Ltd. |
Heat sink |
| D541229, |
May 13 2004 |
SANYO DENKI CO LTD |
Electronic component cooling apparatus |
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| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a