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Patent
D593042
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Priority
Jan 31 2008
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Filed
Jul 29 2008
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Issued
May 26 2009
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Expiry
May 26 2023
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Assg.orig
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Entity
unknown
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5
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25
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a front elevation view of a heat sink according to our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines define portions of the heat sink that form no part of the claimed design.
Otsuki, Takaya, Yamashita, Takamasa, Akase, Tatsuya, Hirakawa, Akira
| Patent |
Priority |
Assignee |
Title |
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Dec 17 1996 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Heat sink device having radial heat and airflow paths |
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Sep 10 2001 |
Intel Corporation |
Radial folded fin heat sinks and methods of making and using same |
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Sep 10 2001 |
Micron Technology, Inc |
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Mar 13 2003 |
Intel Corporation |
Split fin heat sink |
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Apr 30 2003 |
Hewlett Packard Enterprise Development LP |
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Jan 09 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD |
Heat dissipation device having phase-changeable medium therein |
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May 25 2004 |
HANGER SOLUTIONS, LLC |
Heat-dissipation fins |
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Jun 10 2003 |
Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
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Dec 09 2003 |
Fujikura Ltd. |
Heat sink |
| D509485, |
Dec 09 2003 |
Fujikura Ltd. |
Heat sink |
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Jun 25 2003 |
Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
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Jun 25 2003 |
Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
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Electronic component cooling apparatus |
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Sep 28 2006 |
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Heat dissipating module |
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Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
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Jan 25 2007 |
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| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a