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The ornamental design for an electronic component cooling apparatus, as shown and described.
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FIG. 1 is a front side elevation view.
FIG. 2 is a rear side elevation view.
FIG. 3 is a right side elevation view.
FIG. 4 is a left side elevation view.
FIG. 5 is a top plan view.
FIG. 6 is a bottom plan view; and,
FIG. 7 is a perspective view.
Ogawara, Toshiki, Iijima, Masayuki, Watanabe, Michinori, Maruyama, Haruhisa
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 08 2003 | WATANABE, MICHINORI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0500 | |
| Dec 08 2003 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0500 | |
| Dec 08 2003 | IIJIMA, MASAYUKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0500 | |
| Dec 08 2003 | MARUYAMA, HARUHISA | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0500 | |
| Dec 23 2003 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
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