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The ornamental design for an electronic component cooling apparatus, as shown. |
FIG. 1 is a front view of an electronic component cooling apparatus showing our new design;
FIG. 2 is a left side view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a bottom plan view thereof.
Kodama, Nobumasa, Ogawara, Toshiki, Kodaira, Yuichi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 16 1998 | KODAIRA, YUICHI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009067 | /0236 | |
Mar 16 1998 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009067 | /0236 | |
Mar 16 1998 | KODAMA, NOBUMASA | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009067 | /0236 | |
Mar 19 1998 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
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