|
The ornamental design for an electronic component cooling apparatus, as shown and described.
|
|||||||||||||||||
FIG. 1 is a front side elevation view.
FIG. 2 is a rear side elevation view.
FIG. 3 is a right side elevation view.
FIG. 4 is a left side elevation view.
FIG. 5 is a top plan view.
FIG. 6 is a bottom plan view; and,
FIG. 7 is a perspective view.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Ogawara, Toshiki, Iijima, Masayuki, Watanabe, Michinori, Maruyama, Haruhisa
| Patent | Priority | Assignee | Title |
| 7152666, | Nov 14 2003 | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD | Heat sink |
| 7532472, | Apr 14 2006 | HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD | Heat dissipation device |
| 8256258, | Jan 15 2007 | Advantest Corporation; NIDEC CORPORATION | Radiator, heat sink fan, and radiator manufacturing method |
| 8665595, | Jun 06 2002 | OL SECURITY LIMITED LIABILITY COMPANY | Method and apparatus for cooling a circuit component |
| D537418, | Jun 25 2003 | Sanyo Denki Co., Ltd. | Heat sink |
| D576567, | Feb 13 2007 | NIDEC CORPORATION | Heat sink fan |
| D593042, | Jan 31 2008 | NIDEC CORPORATION | Heat sink |
| D778853, | Aug 06 2013 | Phoenix Contact GmbH & Co. KG | Housing for electrical or electronic component |
| D796460, | Aug 06 2013 | Phoenix Contact GmbH & Co. KG | Housing for electrical or electronic component |
| Patent | Priority | Assignee | Title |
| 5597034, | Jul 01 1994 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | High performance fan heatsink assembly |
| 6407919, | Dec 18 2000 | Structure of computer CPU heat dissipation module | |
| 6418020, | Mar 30 2001 | AERLS THERMAL TECHNOLOGY, INC | Heat dissipation device with ribbed fin plates |
| 6419007, | Mar 30 2001 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
| 6480383, | Sep 29 2000 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| 6671172, | Sep 10 2001 | Micron Technology, Inc | Electronic assemblies with high capacity curved fin heat sinks |
| D403760, | Mar 19 1998 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| D441724, | May 22 2000 | Thermosonic Technology Inc. | Heat sink |
| D441725, | Oct 04 2000 | Thermosonic Technology Inc. | Heat sink |
| D442565, | Nov 07 2000 | Thermosonic Technology Inc. | Heat sink |
| D442566, | Nov 14 2000 | Thermosonic Technology Inc. | Heat sink |
| D450306, | May 18 2001 | Enlight Corporation | Heat sink |
| D464939, | Dec 26 2001 | Thermal Integration Technology Inc. | Heat sink |
| D476958, | Apr 30 2002 | Asia Vital Components Co., Ltd. | Radiator |
| D501450, | Jun 10 2003 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| JP1019375, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 08 2003 | WATANABE, MICHINORI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0563 | |
| Dec 08 2003 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0563 | |
| Dec 08 2003 | IIJIMA, MASAYUKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0563 | |
| Dec 08 2003 | MARUYAMA, HARUHISA | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0563 | |
| Dec 23 2003 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |