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The ornamental design for a heat sink, as shown and described.
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This article is formed with a plurality of metallic fins which are integrally provided on a metallic base. This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.
FIG. 1 is a front side elevation view.
FIG. 2 is a right side elevation view.
FIG. 3 is a top plan view.
FIG. 4 is a bottom plan view; and,
FIG. 5 is a perspective view.
The rear side elevation view is omitted because it appears the same way as the front side elevation view. Likewise, the left side elevation view is omitted because it appears the same way as the right side elevation view.
Ogawara, Toshiki, Iijima, Masayuki, Watanabe, Michinori, Maruyama, Haruhisa
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 08 2003 | WATANABE, MICHINORI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0476 | |
Dec 08 2003 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0476 | |
Dec 08 2003 | IIJIMA, MASAYUKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0476 | |
Dec 08 2003 | MARUYAMA, HARUHISA | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014256 | /0476 | |
Dec 23 2003 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
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