Patent
   D537418
Priority
Jun 25 2003
Filed
Dec 23 2003
Issued
Feb 27 2007
Expiry
Feb 27 2021

TERM.DISCL.
Assg.orig
Entity
unknown
3
15
n/a
The ornamental design for a heat sink, as shown and described.

This article is formed with a plurality of metallic fins which are integrally provided on a metallic base. This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.

FIG. 1 is a front side elevation view.

FIG. 2 is a right side elevation view.

FIG. 3 is a top plan view.

FIG. 4 is a bottom plan view; and,

FIG. 5 is a perspective view.

The rear side elevation view is omitted because it appears the same way as the front side elevation view. Likewise, the left side elevation view is omitted because it appears the same way as the right side elevation view.

Ogawara, Toshiki, Iijima, Masayuki, Watanabe, Michinori, Maruyama, Haruhisa

Patent Priority Assignee Title
7423877, Sep 01 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device
7532472, Apr 14 2006 HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD Heat dissipation device
8385071, Apr 16 2008 Asia Vital Components Co., Ltd. Heat radiator
Patent Priority Assignee Title
5597034, Jul 01 1994 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P High performance fan heatsink assembly
6407919, Dec 18 2000 Structure of computer CPU heat dissipation module
6418020, Mar 30 2001 AERLS THERMAL TECHNOLOGY, INC Heat dissipation device with ribbed fin plates
6671172, Sep 10 2001 Micron Technology, Inc Electronic assemblies with high capacity curved fin heat sinks
6927979, Sep 12 2002 Sanyo Denki Co., Ltd. Heat-emitting element cooling apparatus
D441724, May 22 2000 Thermosonic Technology Inc. Heat sink
D441725, Oct 04 2000 Thermosonic Technology Inc. Heat sink
D442565, Nov 07 2000 Thermosonic Technology Inc. Heat sink
D442566, Nov 14 2000 Thermosonic Technology Inc. Heat sink
D450306, May 18 2001 Enlight Corporation Heat sink
D464939, Dec 26 2001 Thermal Integration Technology Inc. Heat sink
D476958, Apr 30 2002 Asia Vital Components Co., Ltd. Radiator
D501450, Jun 10 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D509483, Jun 25 2003 Sanyo Denki Co., Ltd. Heat sink
D511326, Jun 25 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 08 2003WATANABE, MICHINORISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0142560476 pdf
Dec 08 2003OGAWARA, TOSHIKISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0142560476 pdf
Dec 08 2003IIJIMA, MASAYUKISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0142560476 pdf
Dec 08 2003MARUYAMA, HARUHISASANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0142560476 pdf
Dec 23 2003Sanyo Denki Co., Ltd.(assignment on the face of the patent)
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