A structure of computer cpu heat dissipation module comprising a heat dissipation fin, a heat dissipation fan, a pair of fastening element, the cpu being mounted at a cpu seat and the top of the cpu mounted with the heat dissipation fin, and the top face of the heat fin being mounted with the heat dissipation fan which is then fastened by the fastening element, characterized in that the heat dissipation fin is a cubic structure having a height approximate the same as the length and width and the heat dissipation side fin is protruded toward the surrounding and the bottom end thereof is tapered, and the heat dissipation fan has a fan body enclosed a unidirectional mask housing which can exactly cover the wall of the top surrounding of the heat dissipation fin such that the fan body is stacked on the top of the heat dissipation fin, and the fastening element has one end being a fastening body, and the other end is a fastening ring, the back end of the fastening body has a suspension clip so as to fasten the top end at the two lateral wall of the mask housing, thereby the fastening body can cause the fastening ring to fasten the fastening hook corresponding to the cpu seat.

Patent
   6407919
Priority
Dec 18 2000
Filed
Dec 18 2000
Issued
Jun 18 2002
Expiry
Dec 18 2020
Assg.orig
Entity
Small
38
14
EXPIRED
1. A structure of computer cpu heat dissipation module comprising a heat dissipation fin, a heat dissipation fan, a pair of fastening elements, the cpu being mounted at a cpu seat and the top of the cpu mounted with the heat dissipation fin, and the top face of the heat dissipation fin being mounted with the heat dissipation fan which is then fastened by the fastening element, characterized in that the heat dissipation fin is a cubic structure having a height approximate the same as the length and width and the heat dissipation side fin is protruded toward the surrounding and the bottom end thereof is tapered, and the heat dissipation fan has a fan body enclosed by a unidirectional mask housing which can exactly cover the wall of the top surrounding of the heat dissipation fin such that the fan body is stacked on the top of the heat dissipation fin, and the fastening element has one end being a fastening body, and the other end is a fastening ring, the back end of the fastening body has a suspension clip so as to fasten the top end at the two lateral wall of the mask housing, thereby the fastening body can cause the fastening ring to fasten a fastening hook corresponding to the cpu seat.
2. A structure of computer cpu heat dissipation module as set forth in claim 1, wherein the surrounding of the interior of the mask housing is provided with a positioning block and the fan body, corresponding to the positioning block, is provided with a recess such that the fan body can mount at a specific face.
3. A structure of computer cpu heat dissipation module as set forth in, claim 1, wherein the two lateral mask board of the mask housing are provided with a pair of through slots, and the back position of the slot, an inverse engaging-hook wall is extended, and the lateral wall of the heat dissipation fin, corresponding to the inverse engaging-hook, a fastening slot is formed, such that when the heat dissipation fan covers the top of the heat dissipation fin, the inverse engaging hook wall is engaged at the fastening slot, and the fan body is stacked on the top of the heat dissipation fin.

(a) Field of the Invention

The present invention relates to a structure of computer CPU heat dissipation module, and in particular, a heat dissipation fan with a mask housing mounted at the external of the fan. The heat dissipation fin is a cube with a large volume of heat dissipation capacity.

(b) Description of the Prior Art

The upgrading of computer CPU efficiency is important in all computers. If the operation ability of the CPU is faster, the operation ability of the computer with this CPU will be faster. Thus, it is a trend that the speed of CPU is to be upgraded in the manufacturing of computers. However, the heat energy generated by a high speed CPU of a computer will relatively higher, and therefore, a powerful heat dissipation module has to be mounted to the CPU of the computer so as to reduce the working temperature of the CPU in order to maintain normal operation.

FIG. 1 shows a conventional computer CPU heat dissipation module. This module has thin heat dissipation fin 10, or on the heat dissipation fin 10, a heat dissipation fan 20 with a small thickness is mounted. The surrounding of the heat dissipation fan 20 does not have a mask body 21. Even the heat dissipation fan is equipped with such a mask body 21, the mask body 21 and the fan body 22 are normally mounted on a securing housing body, and the height thereof is similar to that of the fan body 22. The heat dissipation body 10 is a flat board having a top end extended to a plurality of the heat dissipation side fins 11, 12 being the heat conductor. The flat, back surface at the other end of the heat dissipation side fins 11, 12 is adhered to the CPU top surface by a sealing adhesive, and a fastening hook 23 at the surrounding of the heat dissipation fan 20 is engaged with the heat dissipation side fins 11, 12 to form an entire structure.

The above structure can solve the heat dissipation of the CPU of the currently available computer. As shown in FIG. 2, the thickness of the heat dissipation fin 10 being mounted with the heat dissipation fan 20 is not thick, and the volume of heat dissipation of the heat dissipation fin 10 restricts the CPU heat dissipation area to the hot air discharge end of the heat dissipation fan 20. There is only a short heat transfer distance and due to the short distance of the mask body 21, convection current turbulence is formed at the surrounding of the heat dissipation fan 20, which formed into improper air resistance so that the heat discharging efficiency of heat energy is low. If the discharged heat energy is large, the function of heat dissipation is poor. It is understood that this drawback still exists in small for the heat dissipation fin 10 with low volume of heat dissipation, and if the distance of heat dissipation is short, the ventilation at the mask housing 21 is insufficient.

Accordingly, it is the objection of the present invention to provide a structure of computer CPU heat dissipation module to mitigate the above drawbacks.

Accordingly, it is an object of the present invention to provide a structure of computer CPU heat dissipation module comprising a heat dissipation fin, a heat dissipation fan, a pair of fastening elements, the CPU being mounted at a CPU seat and the top of the CPU mounted with the heat dissipation fin, and the top face of the heat fin being mounted with the heat dissipation fan which is then fastened by the fastening element, characterized in that the heat dissipation fin is a cubic structure having a height approximate the same as the length and width and the heat dissipation side fin is protruded toward the surrounding, and the bottom end thereof is tapered, and the heat dissipation fan has a fan body enclosed a unidirectional mask housing which can exactly cover the wall of the top surrounding of the heat dissipation fin such that the fan body is stacked onto the top of the heat dissipation fin, and the fastening element has one end being a fastening body, and the other end is a fastening ring, the back end of the fastening body has a suspension clip so as to fasten the top end at the two lateral wall of the mask housing, thereby the fastening body can cause the fastening ring to fasten the fastening hook corresponding to the CPU seat.

Yet another object of the present invention to provide a structure of computer CPU heat dissipation module, wherein there is a sufficient distance from the bottom edge of the mask housing to the bottom end of the heat dissipation fin and the convection current turbulence is avoided.

A further object of the present invention to provide a structure of computer CPU heat dissipation module, wherein the heat dissipation module can be used for high speed CPU.

Another object of the present invention to provide a structure of computer CPU heat dissipation module, wherein the mask housing can be removed from the fan body to allow easy maintenance and replacement of parts.

Other object and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawing.

FIG. 1 is a perspective view of a conventional computer CPU heat dissipation module.

FIG. 2 is a schematic view showing the action of a computer CPU heat dissipation module.

FIG. 3 is a perspective view of a computer CPU heat dissipation module of the present invention.

FIG. 4 is a perspective exploded view of a computer CPU heat dissipation module of the present invention.

FIG. 5 is a perspective exploded view of a computer CPU heat dissipation module of the present invention.

FIG. 6 is schematic view of the fastening action of a computer CPU heat dissipation module of the present invention.

FIG. 7 is an action of heat dissipation of the computer CPU heat dissipation module of the present invention.

Referring to FIGS. 3 and 4, there is shown a new computer CPU heat dissipation module comprising a heat dissipation fin 100, a heat dissipation fan 200, and a pair of clipping elements 300. After the CPU 400 is mounted at a CPU seat 500, the top of the CPU 400 is stacked with the heat dissipation fin 100, and the top face of the heat fin 100 is mounted with the heat dissipation fan 200. The clipping elements 300 are used to mount the entire structure, and in particular, the heat dissipation fin 100 is a cubic structure having a height, which is approximately equal to the width and length thereof. A plurality of heat dissipation side fins 101, 102, 103 are extended toward the circumferential edge of the structure. The bottom end of the surrounding is tapered, and the heat dissipation fan 200 (as shown in FIG. 5) comprises a fan body 210 enclosed by a mask housing 220, which is unidirectional protruded. At an appropriate position within the mask housing 220, a positioning block 225 is protrudedly mounted, which is associated with the positioning recess 211 formed on the surrounding of the fan body 210 such that the fan body 210 can only be mounted at one specific side thereof with the mask housing 220, avoiding the reverse mounting of the fan body 210 and avoiding wrong air ventilation direction of the heat dissipation fan 200.

At the two lateral mask boards of the mask housing 220,a pair of straight through slots 221, 222 is provided. The back of the boards between the pair of the straight through slots 221, 222 are at an appropriate height, and a reverse engaging-hook wall 223, 224 are formed integrally, such that the mask housing 220 can be exactly mounted at the exterior of the side wall of the heat dissipation fin 100. The lateral wall of the heat dissipation fin 100, corresponding to the inverse engaging-hook walls 223, 224, is provided with a fastening slot 110, and when the heat dissipation fan 200 is mounted at the top of the heat fin 100, the inverse engaging-hook walls 223, 224 can be engaged with the corresponding fastening slot 110 such that when the fan body 210 is engaged at the top of the heat dissipation fin 100 and the fan 200 is to be removed from the fin 100, a tool with a flat pointed tip is used to trigger the gap between the through slot 221,222 and the fin 100 such that the engaging-hook walls 223, 224 are disengaged from the corresponding fastening slot 110 so as to remove the heat dissipation fan 200. As the fan body 210 and the mask housing are mounted by the method fastening, the mask housing 220 can be removed from the fan body 210, allowing easy replacement of components and maintenance of the computer.

The fastening element 300 has one end being a fastening body 310 and the other end being a fastening ring 320, and the fastening ring 320 is a ring body with a bending section in association with the width of the CPU seat 500, and the rear end of the fastening body 310 is provided with a suspension clip 311 so as to mount at the top end of the two lateral sides of the mask housing 220. As shown in FIG. 6, by triggering the fastening body 310, the fastening ring 320 is fastened with the fastening hooks 501, 502, corresponding to the CPU seat 500 for mounting to form a stacked and mounted structure. With respect to heat dissipating effectiveness, as shown in FIG. 7, the heat dissipation fin 100 has extremely large heat dissipation volume and heat dissipation path and his allows greater heat energy absorption by absorbing heat evolved by the CPU 400. The tapered bottom end of the heat dissipation fin 100 formed into an extended slanting side increases the contact surface of the bottom section with the surrounding air, such that the ventilation at the bottom section can assist in transferring the heat energy of the heat dissipation side fin, and thus the heat dissipation effectiveness of the entire heat dissipation fin 100 is excellent. In addition, the mask housing 220 has an external long masking plate, which can guide the heat dissipation air current between the individual heat dissipation side plates at the top of the heat dissipation fin 100, to produce the exact direction of flow, which is indicated by the indication of the arrow.

There is a sufficient distance between the bottom edge of the mask housing 220 to the bottom end of the heat dissipation fin 100 so as to provide a distance between the fan and the CPU 400 and forms convection current turbulence, which lowers the heat energy dissipation.

While the invention has been described with respect to preferred embodiments, it will be clear to those skilled in the art that modifications and improvements may be made to the invention without departing from the spirit and scope of the invention. Therefore, the invention is not to be limited by the specific illustrative embodiment, but only by the scope of the appended claims.

Chou, Fargo

Patent Priority Assignee Title
10692798, Apr 10 2014 ADVANCED THERMAL SOLUTIONS, INC Multiple flow entrance heat sink
6547540, Sep 28 2001 Sunonwealth Electric Machine Industry Co., Ltd. Supercharging structure for a fan
6598666, Jun 18 2001 Global Win Technology Co., Ltd. CPU cooling arrangement
6712127, Mar 03 2001 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
6782941, Mar 03 2001 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
6896046, Jun 28 2002 Hon Hai Precision Ind. Co., LTD Heat dissipation assembly with fan mounting device
6924982, Jan 10 2003 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly including heat sink and fan
7113403, Apr 07 2004 Asia Vital Component Co., Ltd. Centrifugal fan type cooling module
7123483, Dec 26 2003 NIDEC CORPORATION Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan
7150311, Dec 02 2004 Asia Vital Component Co., Ltd. Radiation module capable of resisting reverse flow of hot fluid
7160080, Dec 25 2003 Asia Vital Component Co., Ltd.; ASIA VITAL COMPONENT CO LTD Fan assembly
7178587, Dec 20 2004 Asia Vital Component Co., Ltd. Heat-dissipating module
7480144, Nov 03 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device
7532472, Apr 14 2006 HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD Heat dissipation device
7589967, Dec 01 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device
7965506, Aug 22 2007 Nvidia Corporation Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
8385071, Apr 16 2008 Asia Vital Components Co., Ltd. Heat radiator
8593814, Jan 26 2011 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. Heat sink assembly
8622119, Dec 18 2009 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Fixing frame and heat dissipation device using the same
8665595, Jun 06 2002 OL SECURITY LIMITED LIABILITY COMPANY Method and apparatus for cooling a circuit component
8800951, Jun 05 2012 Hon Hai Precision Industry Co., Ltd. Mounting device for fan
8944402, Jun 05 2012 SCIENBIZIP CONSULTING SHENZHEN CO ,LTD Mounting device for fan
9069520, Feb 29 2012 Aopen Inc Securing device, and assembly including the securing device and a heat dissipating module
D478875, Nov 05 2001 Zalman Tech Co., Ltd. Duct and housing unit for a heat sink for electronic equipment
D509483, Jun 25 2003 Sanyo Denki Co., Ltd. Heat sink
D511326, Jun 25 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D516526, Jun 25 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
D537418, Jun 25 2003 Sanyo Denki Co., Ltd. Heat sink
D561120, Sep 28 2006 Delta Electronics, Inc. Heat dissipating module
D561121, Jan 30 2007 Fujikura Ltd Heat sink
D561122, Jan 30 2007 Fujikura Ltd Heat sink
D561123, Jan 30 2007 Fujikura Ltd Heat sink
D561124, Jan 30 2007 Fujikura Ltd Heat sink
D564460, Jan 25 2007 NIDEC CORPORATION Heat sink fan
D575242, Apr 05 2006 NIDEC CORPORATION Fan
D576567, Feb 13 2007 NIDEC CORPORATION Heat sink fan
D576963, Jan 30 2007 Fujikura Ltd Heat sink
D584698, Jul 03 2006 Delta Electronics Inc. Fan
Patent Priority Assignee Title
4715438, Jun 30 1986 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
5475564, Dec 20 1994 CPU heat sink holding-down device
5597034, Jul 01 1994 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P High performance fan heatsink assembly
5664622, May 30 1996 Heat sink with deformable hangers for mounting
5678627, Jan 03 1996 CPU heat sink mounting structure
5740014, Dec 11 1996 CPU heat sink
5943209, Oct 06 1997 HANGER SOLUTIONS, LLC Modularized electronic component cooling apparatus
5960862, Aug 29 1996 TRANYOUNG TECHNOLOGY CORP CPU heat sink mounting structure
6160704, Dec 17 1998 Intelligent Motion Systems Integral heat-sink and motor assembly for printed circuit boards
6336499, May 31 2001 CPU heat sink mounting structure
6343014, Aug 11 2000 Ming-Chuan, Yu CPU cooling arrangement
JP2000340726,
JP407297331,
JP410223816,
Executed onAssignorAssigneeConveyanceFrameReelDoc
Date Maintenance Fee Events
Jan 04 2006REM: Maintenance Fee Reminder Mailed.
Jun 19 2006EXP: Patent Expired for Failure to Pay Maintenance Fees.


Date Maintenance Schedule
Jun 18 20054 years fee payment window open
Dec 18 20056 months grace period start (w surcharge)
Jun 18 2006patent expiry (for year 4)
Jun 18 20082 years to revive unintentionally abandoned end. (for year 4)
Jun 18 20098 years fee payment window open
Dec 18 20096 months grace period start (w surcharge)
Jun 18 2010patent expiry (for year 8)
Jun 18 20122 years to revive unintentionally abandoned end. (for year 8)
Jun 18 201312 years fee payment window open
Dec 18 20136 months grace period start (w surcharge)
Jun 18 2014patent expiry (for year 12)
Jun 18 20162 years to revive unintentionally abandoned end. (for year 12)