Patent
   D561122
Priority
Jan 30 2007
Filed
Jan 30 2007
Issued
Feb 05 2008
Expiry
Feb 05 2022
Assg.orig
Entity
unknown
3
9
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right elevational view thereof;

FIG. 5 is a left elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view similar to FIG. 1 showing the fan housing removed form the extrusion.

Saito, Yuji, Mochizuki, Masataka

Patent Priority Assignee Title
7495921, Jan 24 2007 CHAMP TECH OPTICAL FOSHAN CORPORATION Fan bracket and heat dissipation apparatus incorporating the same
7532472, Apr 14 2006 HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD Heat dissipation device
D576567, Feb 13 2007 NIDEC CORPORATION Heat sink fan
Patent Priority Assignee Title
6407919, Dec 18 2000 Structure of computer CPU heat dissipation module
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D501450, Jun 10 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 30 2007Fujikura Ltd.(assignment on the face of the patent)
Feb 01 2007MOCHIZUKI, MASATAKAFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0190480867 pdf
Feb 01 2007SAITO, YUJIFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0190480867 pdf
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