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The ornamental design for a electronic component cooling apparatus, as shown and described.
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FIG. 1 is a front view of an electronic component cooling apparatus according to our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a cross-sectional view along line 8—8 of FIG. 5.
Ogawara, Toshiki, Iijima, Masayuki, Watanabe, Michinori, Maruyama, Haruhisa
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 30 2003 | WATANABE, MICHINORI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014278 | /0245 | |
May 30 2003 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014278 | /0245 | |
May 30 2003 | IIJIMA, MASAYUKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014278 | /0245 | |
May 30 2003 | MARUYAMA, HARUHISA | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014278 | /0245 | |
Jun 10 2003 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
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