Patent
   D576963
Priority
Jan 30 2007
Filed
Jan 30 2007
Issued
Sep 16 2008
Expiry
Sep 16 2022
Assg.orig
Entity
unknown
4
8
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right elevational view thereof;

FIG. 4 is a left elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view similar to FIG. 1 showing the fan removed form the extrusion.

A rear elevational view is the same as the right elevational view.

Saito, Yuji, Mochizuki, Masataka

Patent Priority Assignee Title
7778032, Jun 13 2008 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Fan impeller and heat dissipating device incorporating the same
7942194, Apr 10 2007 Fujikura Ltd. Heat sink
8365811, Dec 07 2007 NIDEC CORPORATION Heat sink fan
D829183, Jun 15 2017 SHENZHEN GAOYU ELECTRONIC TECHNOLOGY CO., LTD. Graphic card radiator
Patent Priority Assignee Title
6407919, Dec 18 2000 Structure of computer CPU heat dissipation module
7221567, Apr 12 2004 NIDEC CORPORATION Heat sink fan
20020182068,
20050141992,
20050271506,
20050280992,
20060219386,
D501450, Jun 10 2003 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 30 2007Fujikura Ltd.(assignment on the face of the patent)
Feb 01 2007MOCHIZUKI, MASATAKAFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0191900376 pdf
Feb 01 2007SAITO, YUJIFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0191900376 pdf
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