Patent
   D561123
Priority
Jan 30 2007
Filed
Jan 30 2007
Issued
Feb 05 2008
Expiry
Feb 05 2022
Assg.orig
Entity
unknown
6
9
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right elevational view thereof;

FIG. 4 is a left elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view similar to FIG. 1 showing the fan removed form the extrusion.

A rear elevational view is the same as the right elevational view.

Saito, Yuji, Mochizuki, Masataka

Patent Priority Assignee Title
7495921, Jan 24 2007 CHAMP TECH OPTICAL FOSHAN CORPORATION Fan bracket and heat dissipation apparatus incorporating the same
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7583503, Nov 20 2007 Asia Vital Components Co., Ltd. Thermal module allowing adjustment in the height of heat sink relative to fixing rack
D593511, Jul 18 2008 Foxconn Technology Co., Ltd. Heat dissipation device
D597498, Jul 18 2008 Foxconn Technology Co., Ltd. Heat dissipation device
D600218, Jun 20 2007 NIDEC CORPORATION Heat sink
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 30 2007Fujikura Ltd.(assignment on the face of the patent)
Feb 01 2007MOCHIZUKI, MASATAKAFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0190480833 pdf
Feb 01 2007SAITO, YUJIFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0190480833 pdf
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