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Patent
D561123
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Priority
Jan 30 2007
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Filed
Jan 30 2007
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Issued
Feb 05 2008
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Expiry
Feb 05 2022
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Assg.orig
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Entity
unknown
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6
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9
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right elevational view thereof;
FIG. 4 is a left elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view similar to FIG. 1 showing the fan removed form the extrusion.
A rear elevational view is the same as the right elevational view.
Saito, Yuji, Mochizuki, Masataka
Patent |
Priority |
Assignee |
Title |
7495921, |
Jan 24 2007 |
CHAMP TECH OPTICAL FOSHAN CORPORATION |
Fan bracket and heat dissipation apparatus incorporating the same |
7532472, |
Apr 14 2006 |
HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD |
Heat dissipation device |
7583503, |
Nov 20 2007 |
Asia Vital Components Co., Ltd. |
Thermal module allowing adjustment in the height of heat sink relative to fixing rack |
D593511, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D597498, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D600218, |
Jun 20 2007 |
NIDEC CORPORATION |
Heat sink |
Patent |
Priority |
Assignee |
Title |
6407919, |
Dec 18 2000 |
|
Structure of computer CPU heat dissipation module |
7221567, |
Apr 12 2004 |
NIDEC CORPORATION |
Heat sink fan |
20020182068, |
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20050141992, |
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20050271506, |
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20050280992, |
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20060067053, |
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20060219386, |
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D501450, |
Jun 10 2003 |
Sanyo Denki Co., Ltd. |
Electronic component cooling apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a