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Patent
D597498
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Priority
Jul 18 2008
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Filed
Jul 18 2008
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Issued
Aug 04 2009
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Expiry
Aug 04 2023
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Assg.orig
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Entity
unknown
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1
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7
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n/a
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The ornamental design for a heat dissipation device, as shown.
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FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Chen, Ye, Zhao, Di-Qiong, Deng, Hong-Bo
Patent |
Priority |
Assignee |
Title |
7362573, |
Apr 28 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipation device |
20060219386, |
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D511327, |
Mar 24 2004 |
GIGA-BYTE TECHNOLOGY CO., LTD. |
Heat sink |
D552564, |
Jun 01 2006 |
Fujikura Ltd. |
Heat sink |
D561123, |
Jan 30 2007 |
Fujikura Ltd |
Heat sink |
D561711, |
Dec 08 2006 |
Thermaltake Technology Co., Ltd. |
Heat sink |
D573109, |
Jul 10 2007 |
Fujikura Ltd |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a