Patent
   D597498
Priority
Jul 18 2008
Filed
Jul 18 2008
Issued
Aug 04 2009
Expiry
Aug 04 2023
Assg.orig
Entity
unknown
1
7
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Chen, Ye, Zhao, Di-Qiong, Deng, Hong-Bo

Patent Priority Assignee Title
7942194, Apr 10 2007 Fujikura Ltd. Heat sink
Patent Priority Assignee Title
7362573, Apr 28 2006 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipation device
20060219386,
D511327, Mar 24 2004 GIGA-BYTE TECHNOLOGY CO., LTD. Heat sink
D552564, Jun 01 2006 Fujikura Ltd. Heat sink
D561123, Jan 30 2007 Fujikura Ltd Heat sink
D561711, Dec 08 2006 Thermaltake Technology Co., Ltd. Heat sink
D573109, Jul 10 2007 Fujikura Ltd Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 16 2008ZHAO, DI-QIONGFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0212560102 pdf
Jul 16 2008DENG, HONG-BOFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0212560102 pdf
Jul 16 2008CHEN, YEFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0212560102 pdf
Jul 18 2008Foxconn Technology Co., Ltd.(assignment on the face of the patent)
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