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Patent
D561711
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Priority
Dec 08 2006
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Filed
Jan 04 2007
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Issued
Feb 12 2008
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Expiry
Feb 12 2022
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Assg.orig
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Entity
unknown
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22
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8
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a front elevation thereof;
FIG. 3 is a rear elevation thereof;
FIG. 4 is a left side elevation thereof;
FIG. 5 is a right side elevation thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.
Lin, Pei-Hsi
Patent |
Priority |
Assignee |
Title |
10021811, |
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11924996, |
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Liquid-cooling devices, and systems, to cool multi-chip modules |
7796387, |
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Heat dissipation apparatus having a fan received therein |
7942194, |
Apr 10 2007 |
Fujikura Ltd. |
Heat sink |
8430153, |
Oct 12 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device having heat sink enclosing conductive member therein |
9867315, |
Jun 29 2012 |
ASETEK DANMARK A/S |
Server memory cooling apparatus |
D572669, |
Sep 01 2007 |
Asia Vital Components Co., Ltd.; ASIA VITAL COMPONENTS CO , LTD |
Heat dissipation assembly |
D573109, |
Jul 10 2007 |
Fujikura Ltd |
Heat sink |
D593511, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D597498, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D604704, |
Aug 21 2008 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device |
D660256, |
Feb 25 2011 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device |
D677636, |
Nov 23 2011 |
Zaonzi Co., Ltd. |
Heat-dissipating radiators for electronic apparatus |
D795821, |
Feb 22 2016 |
Heatscape.com, Inc. |
Liquid cooling cold plate with diamond cut pin fins |
D800674, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Cooling plate row for in-line memory |
D800675, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Set of cooling plate rows for in-line memory |
D803169, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
D829673, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
D954005, |
Sep 12 2019 |
FURUKAWA ELECTRIC CO ; FURUKAWA ELECTRIC CO , LTD |
Heatsink |
D971862, |
Dec 28 2018 |
FURUKAWA ELECTRIC CO , LTD |
Heatsink |
ER8330, |
|
|
|
ER8359, |
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|
Patent |
Priority |
Assignee |
Title |
6883592, |
Nov 04 1998 |
ZALMAN TECH CO , LTD |
Heatsink for electronic component |
20020182068, |
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20050067144, |
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20060061970, |
|
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20060082972, |
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20060137861, |
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|
D480692, |
Sep 04 2002 |
Zalman Tech Co., Ltd. |
Radiator for heat generating components in electronic equipment |
D541757, |
Dec 19 2005 |
Zalman Tech Co., Ltd. |
Radiator for electronic parts |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a