Patent
   D561711
Priority
Dec 08 2006
Filed
Jan 04 2007
Issued
Feb 12 2008
Expiry
Feb 12 2022
Assg.orig
Entity
unknown
22
8
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of a heat sink;

FIG. 2 is a front elevation thereof;

FIG. 3 is a rear elevation thereof;

FIG. 4 is a left side elevation thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Lin, Pei-Hsi

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 04 2006LIN, PEI-HSITHERMALTAKE TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0187050739 pdf
Jan 04 2007Thermaltake Technology Co., Ltd.(assignment on the face of the patent)
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