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Patent
D561711
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Priority
Dec 08 2006
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Filed
Jan 04 2007
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Issued
Feb 12 2008
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Expiry
Feb 12 2022
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Assg.orig
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Entity
unknown
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22
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8
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a front elevation thereof;
FIG. 3 is a rear elevation thereof;
FIG. 4 is a left side elevation thereof;
FIG. 5 is a right side elevation thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.
Lin, Pei-Hsi
| Patent |
Priority |
Assignee |
Title |
| 10021811, |
May 24 2016 |
ASETEK DANMARK A/S |
Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
| 11924996, |
Sep 30 2020 |
CoolIT Systems, Inc |
Liquid-cooling devices, and systems, to cool multi-chip modules |
| 7796387, |
May 25 2008 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation apparatus having a fan received therein |
| 7942194, |
Apr 10 2007 |
Fujikura Ltd. |
Heat sink |
| 8430153, |
Oct 12 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device having heat sink enclosing conductive member therein |
| 9867315, |
Jun 29 2012 |
ASETEK DANMARK A/S |
Server memory cooling apparatus |
| D572669, |
Sep 01 2007 |
Asia Vital Components Co., Ltd.; ASIA VITAL COMPONENTS CO , LTD |
Heat dissipation assembly |
| D573109, |
Jul 10 2007 |
Fujikura Ltd |
Heat sink |
| D593511, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
| D597498, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
| D604704, |
Aug 21 2008 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device |
| D660256, |
Feb 25 2011 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device |
| D677636, |
Nov 23 2011 |
Zaonzi Co., Ltd. |
Heat-dissipating radiators for electronic apparatus |
| D795821, |
Feb 22 2016 |
Heatscape.com, Inc. |
Liquid cooling cold plate with diamond cut pin fins |
| D800674, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Cooling plate row for in-line memory |
| D800675, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Set of cooling plate rows for in-line memory |
| D803169, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
| D829673, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
| D954005, |
Sep 12 2019 |
FURUKAWA ELECTRIC CO ; FURUKAWA ELECTRIC CO , LTD |
Heatsink |
| D971862, |
Dec 28 2018 |
FURUKAWA ELECTRIC CO , LTD |
Heatsink |
| ER8330, |
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|
| ER8359, |
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| Patent |
Priority |
Assignee |
Title |
| 6883592, |
Nov 04 1998 |
ZALMAN TECH CO , LTD |
Heatsink for electronic component |
| 20020182068, |
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| 20050067144, |
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| 20060061970, |
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| 20060082972, |
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| 20060137861, |
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| D480692, |
Sep 04 2002 |
Zalman Tech Co., Ltd. |
Radiator for heat generating components in electronic equipment |
| D541757, |
Dec 19 2005 |
Zalman Tech Co., Ltd. |
Radiator for electronic parts |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a