Patent
   D803169
Priority
Feb 22 2016
Filed
Feb 22 2016
Issued
Nov 21 2017
Expiry
Nov 21 2032
Assg.orig
Entity
unknown
2
19
n/a
The ornamental design for a combined liquid cooling cold plate and vapor chamber, as shown and described.

FIG. 1 is a top perspective view of a combined liquid cooling cold plate and vapor chamber showing our new design;

FIG. 2 is a top perspective disassembled view corresponding to FIG. 1;

FIG. 3 is a left side elevational view thereof;

FIG. 4 a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a front elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines illustrate portions of the combined liquid cooling cold plate and vapor chamber and form no part of the claimed design.

Mira, Ali, Mira, Yashar, Mira, Michael

Patent Priority Assignee Title
D954005, Sep 12 2019 FURUKAWA ELECTRIC CO ; FURUKAWA ELECTRIC CO , LTD Heatsink
D971862, Dec 28 2018 FURUKAWA ELECTRIC CO , LTD Heatsink
Patent Priority Assignee Title
20080007915,
20090044929,
20090268409,
20120261095,
20160118317,
20160234968,
20160327996,
20160363967,
20160366788,
D553170, Feb 09 2007 Amulaire Thermal Technology, Inc Cold plate heat sink
D561711, Dec 08 2006 Thermaltake Technology Co., Ltd. Heat sink
D573110, Jul 27 2007 NIDEC CORPORATION Heat sink
D715747, Sep 06 2013 Mitsubishi Electric Corporation Cooling jacket
D715750, Nov 26 2013 Kilpatrick Townsend & Stockton LLP Power heat sink with imbedded fly cut heat pipes
D755741, Feb 18 2015 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Power device package
D772823, Aug 26 2015 EBULLIENT, INC Heat sink module
D773408, Jun 11 2015 EBULLIENT, INC Redundant heat sink module
D774473, May 28 2015 EBULLIENT, INC Heat sink module
D778852, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 08 2016MIRA, ALIHEATSCAPE COM, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377910919 pdf
Feb 08 2016MIRA, YASHARHEATSCAPE COM, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377910919 pdf
Feb 08 2016MIRA, MICHAELHEATSCAPE COM, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377910919 pdf
Feb 22 2016Heatscape.com, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule