Patent
   D773408
Priority
Jun 11 2015
Filed
Jun 29 2015
Issued
Dec 06 2016
Expiry
Dec 06 2031
Assg.orig
Entity
unknown
10
14
n/a
The ornamental design for a redundant heat sink module, as shown and described.

FIG. 1 is top front perspective view of a redundant heat sink module;

FIG. 2 is a bottom front perspective view of the redundant heat sink module of FIG. 1;

FIG. 3 is top rear perspective view of the redundant heat sink module of FIG. 1;

FIG. 4 is a bottom rear perspective view of the redundant heat sink module of FIG. 1;

FIG. 5 is a top view of the redundant heat sink module of FIG. 1;

FIG. 6 is a bottom view of the redundant heat sink module of FIG. 1;

FIG. 7 is a front view of the redundant heat sink module of FIG. 1;

FIG. 8 is a rear view of the redundant heat sink module of FIG. 1;

FIG. 9 is a left side view of the redundant heat sink module of FIG. 1; and,

FIG. 10 is a right side view of the redundant heat sink module of FIG. 1.

The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.

Lindeman, Brett A.

Patent Priority Assignee Title
10021811, May 24 2016 ASETEK DANMARK A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
11906218, Oct 27 2014 EBULLIENT, INC. Redundant heat sink module
11924996, Sep 30 2020 CoolIT Systems, Inc Liquid-cooling devices, and systems, to cool multi-chip modules
D795821, Feb 22 2016 Heatscape.com, Inc. Liquid cooling cold plate with diamond cut pin fins
D800674, May 24 2016 ASETEK DANMARK A/S; ASETEK DANMARK A S Cooling plate row for in-line memory
D800675, May 24 2016 ASETEK DANMARK A/S; ASETEK DANMARK A S Set of cooling plate rows for in-line memory
D803169, Feb 22 2016 Heatscape.com, Inc. Combined liquid cooling cold plate and vapor chamber
D829673, Feb 22 2016 Heatscape.com, Inc. Combined liquid cooling cold plate and vapor chamber
D873396, Apr 06 2016 Resonac Corporation Cooler
D886967, Apr 06 2016 Resonac Corporation Cooler
Patent Priority Assignee Title
8631860, Sep 29 2009 HONGFUJIN PRECISION ELECTRONICS TIANJIN CO ,LTD Water-cooled heat dissipation system and water tank thereof
9175911, Mar 04 2011 Heat sink assembly
20060162340,
20090044929,
20110155353,
20140030900,
20140069614,
20140311176,
20150124404,
20160118317,
20160128238,
D404720, Feb 06 1997 Heat sink and mounting plate for integrated circuits
D582359, Jan 07 2008 COOLER MASTER DEVELOPMENT CORPORATION Heat dissipator
D715747, Sep 06 2013 Mitsubishi Electric Corporation Cooling jacket
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 29 2015EBULLIENT, INC.(assignment on the face of the patent)
Sep 02 2015LINDEMAN, BRETT A EBULLIENT, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0365820691 pdf
Aug 16 2016EBULLIENT, LLCEBULLIENT, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0394670751 pdf
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