PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D773408
|
Priority
Jun 11 2015
|
Filed
Jun 29 2015
|
Issued
Dec 06 2016
|
Expiry
Dec 06 2031
|
|
Assg.orig
|
|
Entity
unknown
|
10
|
14
|
n/a
|
|
|
The ornamental design for a redundant heat sink module, as shown and described.
|
FIG. 1 is top front perspective view of a redundant heat sink module;
FIG. 2 is a bottom front perspective view of the redundant heat sink module of FIG. 1;
FIG. 3 is top rear perspective view of the redundant heat sink module of FIG. 1;
FIG. 4 is a bottom rear perspective view of the redundant heat sink module of FIG. 1;
FIG. 5 is a top view of the redundant heat sink module of FIG. 1;
FIG. 6 is a bottom view of the redundant heat sink module of FIG. 1;
FIG. 7 is a front view of the redundant heat sink module of FIG. 1;
FIG. 8 is a rear view of the redundant heat sink module of FIG. 1;
FIG. 9 is a left side view of the redundant heat sink module of FIG. 1; and,
FIG. 10 is a right side view of the redundant heat sink module of FIG. 1.
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.
Lindeman, Brett A.
Patent |
Priority |
Assignee |
Title |
10021811, |
May 24 2016 |
ASETEK DANMARK A/S |
Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
11906218, |
Oct 27 2014 |
EBULLIENT, INC. |
Redundant heat sink module |
11924996, |
Sep 30 2020 |
CoolIT Systems, Inc |
Liquid-cooling devices, and systems, to cool multi-chip modules |
D795821, |
Feb 22 2016 |
Heatscape.com, Inc. |
Liquid cooling cold plate with diamond cut pin fins |
D800674, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Cooling plate row for in-line memory |
D800675, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Set of cooling plate rows for in-line memory |
D803169, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
D829673, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
D873396, |
Apr 06 2016 |
Resonac Corporation |
Cooler |
D886967, |
Apr 06 2016 |
Resonac Corporation |
Cooler |
Patent |
Priority |
Assignee |
Title |
8631860, |
Sep 29 2009 |
HONGFUJIN PRECISION ELECTRONICS TIANJIN CO ,LTD |
Water-cooled heat dissipation system and water tank thereof |
9175911, |
Mar 04 2011 |
|
Heat sink assembly |
20060162340, |
|
|
|
20090044929, |
|
|
|
20110155353, |
|
|
|
20140030900, |
|
|
|
20140069614, |
|
|
|
20140311176, |
|
|
|
20150124404, |
|
|
|
20160118317, |
|
|
|
20160128238, |
|
|
|
D404720, |
Feb 06 1997 |
|
Heat sink and mounting plate for integrated circuits |
D582359, |
Jan 07 2008 |
COOLER MASTER DEVELOPMENT CORPORATION |
Heat dissipator |
D715747, |
Sep 06 2013 |
Mitsubishi Electric Corporation |
Cooling jacket |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a