Patent
   D404720
Priority
Feb 06 1997
Filed
Feb 06 1997
Issued
Jan 26 1999
Expiry
Jan 26 2013
Assg.orig
Entity
unknown
11
3
n/a
The ornamental design for a heat sink and mounting plate for integrated circuits, shown and described.

FIG. 1 is a perspective view of the heat sink and mounting plate for integrated circuits showing my new design;

FIG. 2 is a front elevational view thereof, the rear elevational view being identical in appearance;

FIG. 3 is a top plan view thereof, the bottom plan view being identical in appearance; and,

FIG. 4 is a side elevational view thereof, the opposite side view being identical in appearance.

Gayle, Charles

Patent Priority Assignee Title
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Patent Priority Assignee Title
4783428, Nov 23 1987 Semiconductor Components Industries, LLC Method of producing a thermogenetic semiconductor device
4807018, Oct 10 1985 SGS Microelettronica S.p.A. Method and package for dissipating heat generated by an integrated circuit chip
5049973, Jun 26 1990 Intersil Corporation Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
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