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Patent
D404720
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Priority
Feb 06 1997
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Filed
Feb 06 1997
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Issued
Jan 26 1999
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Expiry
Jan 26 2013
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Assg.orig
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Entity
unknown
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11
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3
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n/a
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The ornamental design for a heat sink and mounting plate for integrated circuits, shown and described.
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FIG. 1 is a perspective view of the heat sink and mounting plate for
integrated circuits showing my new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being
identical in appearance;
FIG. 3 is a top plan view thereof, the bottom plan view being identical in
appearance; and,
FIG. 4 is a side elevational view thereof, the opposite side view being
identical in appearance.
Gayle, Charles
Patent |
Priority |
Assignee |
Title |
D772178, |
Sep 26 2015 |
EBULLIENT, INC |
Heat sink module |
D772179, |
Aug 26 2015 |
EBULLIENT, INC |
Heat sink module |
D772822, |
Jun 11 2015 |
EBULLIENT, INC |
Redundant heat sink module |
D772823, |
Aug 26 2015 |
EBULLIENT, INC |
Heat sink module |
D773408, |
Jun 11 2015 |
EBULLIENT, INC |
Redundant heat sink module |
D773409, |
Sep 16 2015 |
|
Multi-chamber heat sink module |
D774472, |
May 28 2015 |
EBULLIENT, INC |
Heat sink module |
D774473, |
May 28 2015 |
EBULLIENT, INC |
Heat sink module |
D786806, |
Sep 26 2015 |
EBULLIENT, INC |
Heat sink module |
D812022, |
Sep 12 2015 |
EBULLIENT, INC |
Multi-chamber heat sink module |
D953280, |
Jan 17 2020 |
Furukawa Electric Co., Ltd |
Heat sink |
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