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Patent
D772823
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Priority
Aug 26 2015
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Filed
Aug 26 2015
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Issued
Nov 29 2016
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Expiry
Nov 29 2031
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Assg.orig
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Entity
unknown
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7
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16
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n/a
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The ornamental design for a heat sink module, as shown and described.
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FIG. 1 is top perspective view of a heat sink module;
FIG. 2 is a bottom perspective view of the heat sink module of FIG. 1;
FIG. 3 is a top view of the heat sink module of FIG. 1;
FIG. 4 is a bottom view of the heat sink module of FIG. 1;
FIG. 5 is a front view of the heat sink module of FIG. 1;
FIG. 6 is a rear view of the heat sink module of FIG. 1;
FIG. 7 is a left side view of the heat sink module of FIG. 1; and,
FIG. 8 is a right side view of the heat sink module of FIG. 1.
Lindeman, Brett A.
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Title |
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Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
Patent |
Priority |
Assignee |
Title |
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Sep 29 2009 |
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Apr 01 1993 |
Fujitsu Limited |
Combined heat sink and fan |
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Feb 06 1997 |
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Heat sink and mounting plate for integrated circuits |
D582359, |
Jan 07 2008 |
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Heat dissipator |
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Sep 06 2013 |
Mitsubishi Electric Corporation |
Cooling jacket |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a