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Patent
D774473
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Priority
May 28 2015
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Filed
Jun 29 2015
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Issued
Dec 20 2016
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Expiry
Dec 20 2031
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Assg.orig
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Entity
unknown
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9
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23
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n/a
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The ornamental design for a heat sink module, as shown and described.
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FIG. 1 is top perspective view of a heat sink module;
FIG. 2 is a bottom perspective view of the heat sink module of FIG. 1;
FIG. 3 is a top view of the heat sink module of FIG. 1;
FIG. 4 is a bottom view of the heat sink module of FIG. 1;
FIG. 5 is a front view of the heat sink module of FIG. 1;
FIG. 6 is a rear view of the heat sink module of FIG. 1;
FIG. 7 is a left side view of the heat sink module of FIG. 1; and,
FIG. 8 is a right side view of the heat sink module of FIG. 1.
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.
Lindeman, Brett A.
Patent |
Priority |
Assignee |
Title |
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May 24 2016 |
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Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
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Sep 30 2020 |
CoolIT Systems, Inc |
Liquid-cooling devices, and systems, to cool multi-chip modules |
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Feb 22 2016 |
Heatscape.com, Inc. |
Liquid cooling cold plate with diamond cut pin fins |
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May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Cooling plate row for in-line memory |
D800675, |
May 24 2016 |
ASETEK DANMARK A/S; ASETEK DANMARK A S |
Set of cooling plate rows for in-line memory |
D803169, |
Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
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Feb 22 2016 |
Heatscape.com, Inc. |
Combined liquid cooling cold plate and vapor chamber |
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Apr 06 2016 |
Resonac Corporation |
Cooler |
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Apr 06 2016 |
Resonac Corporation |
Cooler |
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Housing for electronic modules with cooling fins |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a