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Patent
D774472
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Priority
May 28 2015
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Filed
May 28 2015
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Issued
Dec 20 2016
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Expiry
Dec 20 2031
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Assg.orig
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Entity
unknown
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2
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23
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n/a
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The ornamental design for a heat sink module, as shown and described.
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FIG. 1 is top perspective view of a heat sink module;
FIG. 2 is a bottom perspective view of the heat sink module of FIG. 1;
FIG. 3 is a top view of the heat sink module of FIG. 1;
FIG. 4 is a bottom view of the heat sink module of FIG. 1;
FIG. 5 is a front view of the heat sink module of FIG. 1;
FIG. 6 is a rear view of the heat sink module of FIG. 1;
FIG. 7 is a left side view of the heat sink module of FIG. 1; and,
FIG. 8 is a right side view of the heat sink module of FIG. 1.
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.
Lindeman, Brett A.
Patent |
Priority |
Assignee |
Title |
8644021, |
Nov 25 2011 |
Inventec Corporation |
Cooling module |
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20060162340, |
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20070058342, |
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20160118317, |
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D357900, |
Apr 01 1993 |
Fujitsu Limited |
Combined heat sink and fan |
D404720, |
Feb 06 1997 |
|
Heat sink and mounting plate for integrated circuits |
D494549, |
Apr 14 2003 |
Zalman Tech Co., Ltd. |
Supporting block of VGA chipset cooling device |
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Feb 09 2007 |
Amulaire Thermal Technology, Inc |
Cold plate heat sink |
D553656, |
Feb 09 2007 |
Amulaire Thermal Technology, Inc. |
Cold plate heat sink |
D582359, |
Jan 07 2008 |
COOLER MASTER DEVELOPMENT CORPORATION |
Heat dissipator |
D715747, |
Sep 06 2013 |
Mitsubishi Electric Corporation |
Cooling jacket |
D722576, |
Jul 12 2013 |
Liebherr-Elektronik GmbH |
Housing for electronic modules with cooling fins |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a