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					| Patent    D572669 |  
					| Priority Sep 01 2007 |  
					| Filed Sep 01 2007 |  
					| Issued Jul 08 2008 |  
					| Expiry Jul 08 2022 |  
					|  |  
					| Assg.orig |  
					|  |  
					| Entity unknown |  
					 | 0 |  
					 | 12 |  
					 | 
						  n/a |  
						 
    |  |  | 
			  
			  The ornamental design for a heat dissipation assembly, as shown. | 
 
	
FIG. 1 is a perspective view of a heat dissipation assembly showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
	
	Jiang, Shih-Jie
	
	
	  
 	  	 | Patent | Priority | Assignee | Title | 
	  
	
	
	
	  
 	  	 | Patent | Priority | Assignee | Title | 
	      
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	 | 20030024687, |  |  |  | 
    
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	 | 20080017349, |  |  |  | 
    
	 | D541232, | Dec 19 2005 | Zalman Tech Co., Ltd. | Radiator for electronic parts | 
    
	 | D561711, | Dec 08 2006 | Thermaltake Technology Co., Ltd. | Heat sink | 
	
	
	
	
	
	  
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