Patent
   D572669
Priority
Sep 01 2007
Filed
Sep 01 2007
Issued
Jul 08 2008
Expiry
Jul 08 2022
Assg.orig
Entity
unknown
0
12
n/a
The ornamental design for a heat dissipation assembly, as shown.

FIG. 1 is a perspective view of a heat dissipation assembly showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Jiang, Shih-Jie

Patent Priority Assignee Title
Patent Priority Assignee Title
6189601, May 05 1999 Intel Corporation Heat sink with a heat pipe for spreading of heat
6883592, Nov 04 1998 ZALMAN TECH CO , LTD Heatsink for electronic component
6967845, Nov 05 2003 CPUMate Inc. Integrated heat dissipating device with curved fins
7011144, Mar 31 2004 Hewlett-Packard Development Company, L.P. System and method for cooling electronic assemblies
7011147, Nov 17 2004 Heat pipe type circular radiator with sector cooling fins
7284596, Jun 05 2001 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
7289322, Oct 24 2005 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD Heat sink
20030024687,
20060092613,
20080017349,
D541232, Dec 19 2005 Zalman Tech Co., Ltd. Radiator for electronic parts
D561711, Dec 08 2006 Thermaltake Technology Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 01 2007Asia Vital Components Co., Ltd.(assignment on the face of the patent)
Sep 01 2007JIANG, SHIH-JIEASIA VITAL COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0210430004 pdf
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