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Patent
D572669
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Priority
Sep 01 2007
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Filed
Sep 01 2007
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Issued
Jul 08 2008
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Expiry
Jul 08 2022
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Assg.orig
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Entity
unknown
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0
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12
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n/a
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The ornamental design for a heat dissipation assembly, as shown.
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FIG. 1 is a perspective view of a heat dissipation assembly showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Jiang, Shih-Jie
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
6189601, |
May 05 1999 |
Intel Corporation |
Heat sink with a heat pipe for spreading of heat |
6883592, |
Nov 04 1998 |
ZALMAN TECH CO , LTD |
Heatsink for electronic component |
6967845, |
Nov 05 2003 |
CPUMate Inc. |
Integrated heat dissipating device with curved fins |
7011144, |
Mar 31 2004 |
Hewlett-Packard Development Company, L.P. |
System and method for cooling electronic assemblies |
7011147, |
Nov 17 2004 |
|
Heat pipe type circular radiator with sector cooling fins |
7284596, |
Jun 05 2001 |
Heat Technology, Inc. |
Heatsink assembly and method of manufacturing the same |
7289322, |
Oct 24 2005 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD |
Heat sink |
20030024687, |
|
|
|
20060092613, |
|
|
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20080017349, |
|
|
|
D541232, |
Dec 19 2005 |
Zalman Tech Co., Ltd. |
Radiator for electronic parts |
D561711, |
Dec 08 2006 |
Thermaltake Technology Co., Ltd. |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a