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Patent
D573109
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Priority
Jul 10 2007
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Filed
Jul 10 2007
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Issued
Jul 15 2008
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Expiry
Jul 15 2022
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Assg.orig
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Entity
unknown
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6
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5
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a exploded view thereof.
A rear elevational view is the same as the front elevational view.
A left elevational view is the same as the right elevational view.
Mochizuki, Masataka, Nguyen, Thang, Tacomkang, Roj
Patent |
Priority |
Assignee |
Title |
8430153, |
Oct 12 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device having heat sink enclosing conductive member therein |
D587217, |
Dec 30 2007 |
Zalman Tech Co., Ltd. |
Radiator for a graphics card chipset |
D593511, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D597498, |
Jul 18 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D660256, |
Feb 25 2011 |
Zalman Tech Co., Ltd. |
Radiator for an electronic device |
D677636, |
Nov 23 2011 |
Zaonzi Co., Ltd. |
Heat-dissipating radiators for electronic apparatus |
Date |
Maintenance Fee Events |
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Maintenance Schedule |
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