Patent
   D573109
Priority
Jul 10 2007
Filed
Jul 10 2007
Issued
Jul 15 2008
Expiry
Jul 15 2022
Assg.orig
Entity
unknown
6
5
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a exploded view thereof.

A rear elevational view is the same as the front elevational view.

A left elevational view is the same as the right elevational view.

Mochizuki, Masataka, Nguyen, Thang, Tacomkang, Roj

Patent Priority Assignee Title
8430153, Oct 12 2009 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
D587217, Dec 30 2007 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
D593511, Jul 18 2008 Foxconn Technology Co., Ltd. Heat dissipation device
D597498, Jul 18 2008 Foxconn Technology Co., Ltd. Heat dissipation device
D660256, Feb 25 2011 Zalman Tech Co., Ltd. Radiator for an electronic device
D677636, Nov 23 2011 Zaonzi Co., Ltd. Heat-dissipating radiators for electronic apparatus
Patent Priority Assignee Title
20060061970,
20060082972,
20060219386,
D541757, Dec 19 2005 Zalman Tech Co., Ltd. Radiator for electronic parts
D561711, Dec 08 2006 Thermaltake Technology Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 10 2007Fujikura Ltd.(assignment on the face of the patent)
Jul 12 2007NGUYEN, THANGFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0197680922 pdf
Jul 20 2007MOCHIZUKI, MASATAKAFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0197680922 pdf
Jul 20 2007TACOMKANG, ROJFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0197680922 pdf
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