Patent
   D604704
Priority
Aug 21 2008
Filed
Aug 21 2008
Issued
Nov 24 2009
Expiry
Nov 24 2023
Assg.orig
Entity
unknown
4
5
n/a
The ornamental design for a radiator for an electronic device, as shown and described.

FIG. 1 is a perspective view of the radiator for an electronic device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showing of portion of the radiator is for illustrative purpose only and forms no part of the claimed design.

Seo, Min Whan, Jung, Sang Jun

Patent Priority Assignee Title
8430153, Oct 12 2009 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
D660256, Feb 25 2011 Zalman Tech Co., Ltd. Radiator for an electronic device
D677636, Nov 23 2011 Zaonzi Co., Ltd. Heat-dissipating radiators for electronic apparatus
D829183, Jun 15 2017 SHENZHEN GAOYU ELECTRONIC TECHNOLOGY CO., LTD. Graphic card radiator
Patent Priority Assignee Title
20040226690,
20060060332,
20060272799,
D541232, Dec 19 2005 Zalman Tech Co., Ltd. Radiator for electronic parts
D561711, Dec 08 2006 Thermaltake Technology Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 12 2008JUNG, SANG JUNZALMAN TECH CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0214190891 pdf
Aug 12 2008SEO, MIN WHANZALMAN TECH CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0214190891 pdf
Aug 21 2008Zalman Tech Co., Ltd.(assignment on the face of the patent)
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