|
PTO
Wrapper
PDF
|
|
Dossier
Espace
Google
|
|
|
|
Patent
D552564
|
|
Priority
Jun 01 2006
|
|
Filed
Jun 01 2006
|
|
Issued
Oct 09 2007
|
|
Expiry
Oct 09 2021
|
|
|
|
Assg.orig
|
|
|
|
Entity
unknown
|
|
5
|
|
10
|
|
n/a
|
|
|
|
The ornamental design for a heat sink, as shown and described.
|
FIG. 1 is the perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is the front elevational view thereof;
FIG. 3 is the left elevational view thereof;
FIG. 4 is the top plan view thereof;
FIG. 5 is the bottom plan view thereof;
FIG. 6 is the section view of FIG. 4 along the line VI—VI thereof; and,
FIG. 7 is the section view of FIG. 4 along the line VII—VII.
The right elevational view is the same as the left elevational view.
The back elevational view is the same as the front elevational view.
Mochizuki, Masataka
| Patent |
Priority |
Assignee |
Title |
| 6657862, |
Sep 10 2001 |
Intel Corporation |
Radial folded fin heat sinks and methods of making and using same |
| 6671172, |
Sep 10 2001 |
Micron Technology, Inc |
Electronic assemblies with high capacity curved fin heat sinks |
| 6714415, |
Mar 13 2003 |
Intel Corporation |
Split fin heat sink |
| 20020046826, |
|
|
|
| 20030131970, |
|
|
|
| 20040045702, |
|
|
|
| 20050056399, |
|
|
|
| 20050061480, |
|
|
|
| 20060060332, |
|
|
|
| D466871, |
Dec 12 2000 |
Zalman Tech Co., Ltd |
Radiator for heat generating components in electronic equipment |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a