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Patent
D552564
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Priority
Jun 01 2006
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Filed
Jun 01 2006
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Issued
Oct 09 2007
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Expiry
Oct 09 2021
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Assg.orig
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Entity
unknown
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5
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10
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is the perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is the front elevational view thereof;
FIG. 3 is the left elevational view thereof;
FIG. 4 is the top plan view thereof;
FIG. 5 is the bottom plan view thereof;
FIG. 6 is the section view of FIG. 4 along the line VI—VI thereof; and,
FIG. 7 is the section view of FIG. 4 along the line VII—VII.
The right elevational view is the same as the left elevational view.
The back elevational view is the same as the front elevational view.
Mochizuki, Masataka
Patent |
Priority |
Assignee |
Title |
6657862, |
Sep 10 2001 |
Intel Corporation |
Radial folded fin heat sinks and methods of making and using same |
6671172, |
Sep 10 2001 |
Micron Technology, Inc |
Electronic assemblies with high capacity curved fin heat sinks |
6714415, |
Mar 13 2003 |
Intel Corporation |
Split fin heat sink |
20020046826, |
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20030131970, |
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20040045702, |
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20050056399, |
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20050061480, |
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20060060332, |
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D466871, |
Dec 12 2000 |
Zalman Tech Co., Ltd |
Radiator for heat generating components in electronic equipment |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a