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I claim the ornamental design for a radiator for heat generating components in electronic equipment, as shown and described.
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FIG. 1 is a perspective view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 2 is a front view of a radiator for heat generating components in electronic equipment according to the present invention, the rear view being a mirror image thereof;
FIG. 3 is a right side view of a radiator for heat generating components in electronic equipment according to the present invention, the left side view being a mirror image thereof;
FIG. 4 is a top plan view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 5 is a bottom plan view of a radiator for heat generating components in electronic equipment according to the present invention; and,
FIG. 6 is an exploded view showing the environment in which the design is used.
The broken line showing of the environment is for illustrative purpose only and forms not part of the claimed design.
| Patent | Priority | Assignee | Title |
| D479830, | Jul 20 2002 | Zalman Tech Co., Ltd. | Radiator for heat generating components in electronic equipment |
| D480692, | Sep 04 2002 | Zalman Tech Co., Ltd. | Radiator for heat generating components in electronic equipment |
| D490383, | Nov 15 2002 | Delta Electronics, Inc. | Heat sink with a three-dimensional curved surface |
| D500745, | May 25 2004 | HANGER SOLUTIONS, LLC | Heat-dissipation fins |
| D540750, | Nov 23 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
| D541230, | Nov 23 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
| D541756, | Sep 20 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
| D552564, | Jun 01 2006 | Fujikura Ltd. | Heat sink |
| D568829, | Oct 12 2006 | NIDEC CORPORATION | Heat sink |
| D579421, | Oct 11 2007 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
| D579422, | Oct 22 2007 | Foxconn Technology Co., Ltd. | Heat sink for an LED lamp |
| D592613, | Jun 18 2008 | 4187318 CANADA INC | Heat sink |
| D593963, | Apr 23 2008 | 4187318 CANADA INC | Modular heat sink |
| D643380, | Aug 12 2010 | ENRAYTEK OPTOELECTRONICS CO , LTD | Photoelectric energy transducing apparatus |
| Patent | Priority | Assignee | Title |
| 3566958, | |||
| 4715438, | Jun 30 1986 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
| 5943209, | Oct 06 1997 | HANGER SOLUTIONS, LLC | Modularized electronic component cooling apparatus |
| 6152214, | Feb 01 1996 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD ; AVAGO TECHNOLOGIES GENERAL IP PTE LTD | Cooling device and method |
| 6289975, | Aug 23 1999 | Heat dissipating device | |
| 6330908, | Mar 15 2000 | Foxconn Precision Components Co., Ltd. | Heat sink |
| 6336499, | May 31 2001 | CPU heat sink mounting structure |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 12 2001 | LEE, SANG-CHEOL | ZALMAN TECH CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011892 | /0880 | |
| Jun 07 2001 | Zalman Tech Co., Ltd | (assignment on the face of the patent) | / |
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