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The ornamental design for a heat sink for an led lamp, as shown.
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Yu, Guang, Lai, Cheng-Tien, Shuai, Chun-Jiang
Patent | Priority | Assignee | Title |
D592613, | Jun 18 2008 | 4187318 CANADA INC | Heat sink |
D593963, | Apr 23 2008 | 4187318 CANADA INC | Modular heat sink |
D618633, | Jul 21 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation device |
Patent | Priority | Assignee | Title |
4340115, | Mar 07 1979 | Carrier Corporation | Wrapper for a heat exchange unit |
6439298, | Apr 17 2001 | Jaffe Limited | Cylindrical heat radiator |
7055578, | Jun 03 2004 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly with fan cover |
20040108104, | |||
D466871, | Dec 12 2000 | Zalman Tech Co., Ltd | Radiator for heat generating components in electronic equipment |
D500745, | May 25 2004 | HANGER SOLUTIONS, LLC | Heat-dissipation fins |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 16 2007 | SHUAI, CHUN-JIANG | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019990 | /0435 | |
Oct 16 2007 | YU, GUANG | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019990 | /0435 | |
Oct 16 2007 | LAI, CHENG-TIEN | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019990 | /0435 | |
Oct 22 2007 | Foxconn Technology Co., Ltd. | (assignment on the face of the patent) | / |
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