Patent
   D509485
Priority
Dec 09 2003
Filed
Jun 07 2004
Issued
Sep 13 2005
Expiry
Sep 13 2019
Assg.orig
Entity
unknown
15
7
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a left elevational view thereof;

FIG. 5 is a right elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view similar to FIG. 1 showing the shroud and fan in exploded condition from the fin body of the heat sink.

Mashiko, Koichi, Mochizuki, Masataka

Patent Priority Assignee Title
10692798, Apr 10 2014 ADVANCED THERMAL SOLUTIONS, INC Multiple flow entrance heat sink
7331756, Jun 30 2003 Sanyo Denki Co., Ltd. Axial-flow fan unit and heat-emitting element cooling apparatus
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7742302, Jun 30 2003 Sanyo Denki Co., Ltd. Axial-flow fan unit and heat-emitting element cooling
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Patent Priority Assignee Title
6236569, May 31 2000 Intel Corporation Attaching heat sinks to integrated circuits
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 02 2004MOCHIZUKI, MASATAKAFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0154480155 pdf
Apr 09 2004MASHIKO, KOICHIFujikura LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0154480155 pdf
Jun 07 2004Fujikura Ltd.(assignment on the face of the patent)
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