Patent
   D570301
Priority
May 13 2004
Filed
Oct 25 2006
Issued
Jun 03 2008
Expiry
Jun 03 2022
Assg.orig
Entity
unknown
2
16
n/a
The ornamental design for an electronic component cooling apparatus, as shown and described.

FIG. 1 is a front elevation view of an electronic component cooling apparatus showing our new design;

FIG. 2 is a rear elevation view of the cooling apparatus;

FIG. 3 is a right side elevation view of the cooling apparatus;

FIG. 4 is a left side elevation view of the cooling apparatus;

FIG. 5 is a top plan view of the cooling apparatus;

FIG. 6 is a bottom plan view of the cooling apparatus;

FIG. 7 is a top plan reference view of the cooling apparatus;

FIG. 8 is a longitudinal cross sectional view of the cooling apparatus taken along line 88 in FIG. 7; and,

FIG. 9 is a perspective view of the cooling apparatus.

Ogawara, Toshiki, Watanabe, Michinori, Maruyama, Haruhisa

Patent Priority Assignee Title
D593042, Jan 31 2008 NIDEC CORPORATION Heat sink
D657089, Apr 10 2010 SUZHOU LEKIN SEMICONDUCTOR CO , LTD LED lamp
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 17 2004WATANABE, MICHINORISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184350179 pdf
Dec 17 2004OGAWARA, TOSHIKISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184350179 pdf
Dec 17 2004MARUYAMA, HARUHISASANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184350179 pdf
Oct 25 2006Sanyo Denki Co., Ltd.(assignment on the face of the patent)
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