Patent
   D496338
Priority
Mar 10 2003
Filed
Mar 10 2003
Issued
Sep 21 2004
Expiry
Sep 21 2018
Assg.orig
Entity
unknown
5
6
n/a
The ornamental design for a double-winged radiator for central processing unit, as shown and described.

FIG. 1 is a front elevational view of a double-winged radiator for central processing unit showing our design, a view from the rear being a mirror image;

FIG. 2 is a left side elevational view thereof, a view from the right being a mirror image;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a perspective view thereof.

Chen, Chih-Peng, Lin, Hsin-Cheng

Patent Priority Assignee Title
D567771, Dec 23 2006 Foxconn Technology Co., Ltd. Heat dissipation device
D714235, Sep 07 2012 Fujitsu Limited Radiator for electronic device
D742337, Aug 06 2013 Fujitsu Limited Radiator for electronic device
D819579, Jul 22 2016 Heat sink
D833988, Jul 22 2016 Heat sink
Patent Priority Assignee Title
D357670, Aug 06 1993 OCZ TECHNOLOGY GROUP, INC Heat sink
D450044, Jun 14 2000 Cooler for heat dissipation
D453744, May 11 2001 Foxconn Precision Components Co., Ltd. Heat sink
D465462, Jul 24 2001 Base for a heat dissipating assembly
D481017, Sep 13 2002 Delta Electronics Inc. Heat sink
D484855, Mar 11 2003 Zalman Tech Co., Ltd. Radiator for a heat generating components in electronic equipment
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 18 2003CHEN, CHIH-PENGASIA VITAL COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138580244 pdf
Feb 18 2003LIN, HSIN-CHENGASIA VITAL COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138580244 pdf
Mar 10 2003Asia Vital Components Co., Ltd.(assignment on the face of the patent)
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