Patent
   D486129
Priority
Oct 11 2002
Filed
Jan 09 2003
Issued
Feb 03 2004
Expiry
Feb 03 2018
Assg.orig
Entity
unknown
1
6
n/a
The ornamental design for a heat pipe heat sink assembly, as shown and described.

FIG. 1 is a perspective view of a heat pipe heat sink assembly showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Chen, Chun-Chi, Zhang, Jianjun, Lan, Chin Hsien

Patent Priority Assignee Title
D541758, Dec 19 2005 Zalman Tech Co., Ltd. Radiator for electronic parts
Patent Priority Assignee Title
6269003, Dec 27 1999 Heat dissipater structure
6341644, Jul 01 2000 Foxconn Precision Components Co., Ltd. Heat sink assembly
6397941, Dec 01 1999 TICONA POLYMERS, INC Net-shape molded heat exchanger
6401810, Aug 16 2001 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins
6538889, Sep 20 2001 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Heat dissipation device retention assembly
D400188, May 22 1997 Hon Hai Precision Ind. Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003CHEN, CHUN-CHIHON HAI PRECISION IND CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0136610603 pdf
Jan 03 2003ZHANG, JIANJUNHON HAI PRECISION IND CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0136610603 pdf
Jan 03 2003LAN, CHIN HSIENHON HAI PRECISION IND CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0136610603 pdf
Jan 09 2003Hon Hai Precision Ind. Co., Ltd.(assignment on the face of the patent)
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