The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
|
1. A composite resin mixture comprising:
a highly structured resin comprising highly structured resin molecules;
a less structured resin comprising less structured resin molecules;
wherein said highly structured resin and said less structured resin are mixed to form the composite resin mixture;
wherein the ratio of highly structured resin to less structured resin in the composite resin mixture is from 1:9 to 4:1 by volume;
wherein, within the composite resin mixture, a plurality of the highly structured resin molecules are effective to impose order on a plurality of surrounding less structured resin molecules and to cause the plurality of surrounding less structured resin molecules to adopt an orientation similar to that of the plurality of the highly structured resin molecules, thereby forming ordered micro regions in the composite resin mixture comprising the plurality of the highly structured resin molecules and the plurality of surrounding less structured resin molecules; and
a plurality of cross linking agents effective to covalently bond the plurality of highly structured resin molecules to respective molecules of the plurality of surrounding less structured resin molecules and effective to stabilize the ordered micro regions upon activation of the cross linking agents.
2. The composite resin mixture of
3. The composite resin mixture of
4. The composite resin mixture of
5. The composite resin mixture of
6. The resin mixture of
|
|||||||||||||||||||||||||||||
This application is a Continuation in Part of U.S. application Ser. No. 11/152,984, filed on Jun. 14, 2005 “Structured Resin Systems with High Thermal Conductivity Fillers,” by Smith, et al., which is incorporated herein by reference.
The field of the invention relates to enhancing the crystallinity of non mesogenic resins with mesogenic resins.
With the use of any form of electrical appliance, there is a need to electrically insulate conductors. With the push to continuously reduce the size and to streamline all electrical and electronic systems there is a corresponding need to find better and more compact insulators and insulation systems.
Various epoxy resin materials have been used extensively in electrical insulation systems due to their practical benefit of being tough and flexible electrical insulation materials that can be easily adhered to surfaces. Traditional electrical insulation materials, such as mica flake and glass fiber, can be surface coated and bonded with these epoxy resins, to produce composite materials with increased mechanical strength, chemical resistance and electrical insulating properties. In many cases epoxy resins have replaced traditional varnishes despite such materials having continued use in some high voltage electrical equipment.
Good electrical insulators, by their very nature, also tend to be good thermal insulators, which is undesirable. Thermal insulating behavior, particularly for air-cooled electrical equipment and components, reduces the efficiency and durability of the components as well as the equipment as a whole. It is desirable to produce electrical insulation systems having maximum electrical insulation and minimal thermal insulation characteristics.
Electrical insulation often appears in the form of insulating tapes, which themselves have various layers. Common to these types of tapes is a paper layer that is bonded at an interface to a fiber layer, both layers tending to be impregnated with a resin. A favored type of insulation material is a mica-tape. Improvements to mica tapes include catalyzed mica tapes as taught in U.S. Pat. No. 6,103,882. The mica-tape may be wound around conductors to provide extremely good electrical insulation. An example of this is shown in
Generally, multiple layers of the mica tape 16 are wrapped about the coil with sixteen or more layers generally being used for high voltage coils. Resins are then impregnated into the tape layers. Resins can even be used as insulation independently from the insulating tape. Unfortunately this amount of insulation only further adds to the complications of dissipating heat. What is needed is electrical insulation that can conduct heat higher than that of conventional methods, but that does not compromise the electrical insulation and other performance factors including thermal and mechanical capabilities.
Other difficulties with the prior art also exist, some of which will be apparent upon further reading.
With the foregoing in mind, methods and apparatuses consistent with the present invention, which inter alia facilitates the total degree of order and effective crystallinity of resin system includes the addition of a highly structured resin system to a less structured resin system to impart a degree of order from the structured resin system to the less structured resin system.
These and other objects, features, and advantages in accordance with the present invention provide particular embodiments by a resin mixture that comprises a highly structured resin and a less structured resin. The highly structured resins and the less structured resin are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:2 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
In related embodiments, the ordered micro regions form continuous matrices within the resin mixture. In some embodiment cross-linking agents and/or HTC materials are added. In other related embodiment the HS resins are aligned by means of an external field of force and/or a flow field.
In another embodiment the present invention provides for a method of forming ordered regions within a resin mixture that comprises obtaining a highly structured resin and mixing the highly structured resin with a less structured resin, where the ratio of highly structured resin to less structured resin is from 1:9 to 4:1. The highly structured resin forms ordered regions and the ordered regions impose order on surrounding less structured resin molecules, and the ordered regions form continuous matrices within the resin mixture.
In particular embodiments the mixing is allowed to occur via diffusion, while in others the mixing is mechanical. In some embodiments the HS resin is put onto a material as a layer that the LS resin is impregnated into. Depending on when and how the LS resin is impregnated, the two resins may mix through diffusion, or the actual act of impregnation can provide the physical mixing process.
In still another embodiment the present invention provides for a method of creating a mixed resin matrix with ordered regions that comprises placing a layer of highly structured resin onto a material and impregnating into the material a less structured resin. Then allowing the highly structured resin and the less structured resin to diffuse before curing. The highly structured resin forms ordered regions and the ordered micro regions impose order on surrounding less structured resin molecules.
Other embodiments of the present invention also exist, which will be apparent upon further reading of the detailed description.
The invention is explained in more detail by way of example with reference to the following drawings:
The present invention provides for the seeding of a less structured resin with a structured resin to produce an overall resinous matrix that is more highly structured than just the straight individual structures of the two resin types would produce. Highly structured (HS) resin, such as linear (thermoplastics) or cross linked polymers—(thermosetting) resins, form highly structured regions and as a result have improved physical properties such as higher thermal conductivity in the resin after it is cured.
In an HS resin there are mesogenic regions, which are essentially rigid rod-like sections capable of forming a paracrystalline, crystalline or liquid crystal structure. These regions of HS resins can influence the less structured (LS) resin molecules around them if the HS and LS resins molecules are chemically compatible. In this case, the HS molecules essentially force the LS resin molecules to align with the HS resin molecules, creating a larger structured area that has the enhanced physical properties of the HS resin. Fillers, such as high thermal conductivity (HTC) materials may be added to this heterogeneous structured resin, either before or after the two types of resins are mixed. Some fillers will align themselves within the structured areas.
Non-mesogenic and less and/or partially ordered rod-like resin systems refer to resins that do not tend to form highly structured regions, i.e. crystallize. Although the present application may use the term non-mesogenic, it is to be understood that there can be some small rigid, rod-like section in the non-mesogenic resin, but not enough to form a highly structured region when in a homogeneous matrix. Similarly, a non-mesogenic or partially ordered rod-like resin may not under most circumstances form a highly structured resin, but may have certain molecular aggregation properties when combined with highly structured resin. In other words, by itself, the non-mesogenic resins may not easily crystallize or order, but when combined with HS resins, the heterogeneous mixture may more readily form ordered regions than an HS resin mixed with completely non-mesogenic resins. The term less structured (LS) resin therefore refers to both the non-mesogenic and partially ordered rod-like resins. Resins that are not HS are LS.
When the HS and LS resins are mixed structured areas form, the degree to which the LS forms structured regions is dependant upon the amount of LS to HS resin. For example, a mixture of 95% HS resin would impart a highly ordered structure on the mixture. A 5% HS resin, if thoroughly mixed, would produce a much lower degree of ordering on the mixture. The mixing of the two resins is therefore a consideration, with higher concentrations of HS resin favoring a greater amount of local and extended ordering. The HS resins, however, also will tend to aggregate together even when mixed with the LS resins. These aggregates will therefore form seeds which will encourage ordering of the LS resins around them. These seed will maintain their ordering properties even after repeated melting and recrystallization.
The ratio of HS to LS resins can be varied, but in order to maintain interconnected regions of higher structure, there should be at least 25% of HS resin. The greater amount of HS resin, the greater the number of highly structured regions. The LS resins, however, are useful for a variety of reasons. In general, they are less expensive than HS resins. They may also be less viscous depending on molecular weight and temperature. A straight HS resin, in some applications, may be too viscous for proper impregnation of tape wound and laminate structures, while a HS/LS mixed resin can be sufficiently fluid for penetration, while not sacrificing the majority of the HS properties. Also, the LS resins are known to adhere better to surfaces, such as glass fibers used in tape insulation. Other benefits of the LS resins are dependant on the specific types of LS resins selected such as mechanical and viscoelastic properties and glass transition behavior.
The extent of the conferred ordering of the HS resin on the LS resin depends upon the molecular structure of the LS resin. The degree of conferred ordering will be higher for LS molecules having lower molecular weight and greater rod-like character and having similar centre and end-group chemical group structure to that of the HS resin. The amount of order conferred also depends on the extent that the HS and LS resins are mixed. In examples given, where the resins are layered and allowed to partially diffuse into each other there will be some regions where the two types of resin aren't thoroughly mixed, and therefore no ordering will be imparted.
The LS form up with the HS resins in part due to the structural similarities. For example, epoxy groups at the ends of both chains have an affinity for each other and will closely associate. To help this, cross linking agents can be added. When activated, the cross linking will effectively covalently lock the LS resins to the HS resins, ensuring that the imposed order around the HS regions is stable. This will favor retention of the order in the cross-linked network.
Resins are used in a plurality of industries, and have a large number of uses. Different properties of the resins affect not only their uses, but also the quality and efficiency of the products that they are used with. For example, when resins are used in electrical insulation applications, their characteristics of dielectric strength and voltage endurance needs to be high, as does the thermal stability and thermal endurance. However, often contrary to these objectives, resins usually will also have a low thermal conductivity. The present invention balances the various physical properties of resins and the insulation system they are introduced into to produce a system that has a higher thermal conductivity than conventional electrically insulating materials while maintaining adequate, and even enhancing, key physical and electrical properties such as dielectric strength, voltage endurance, thermal stability and thermal endurance, mechanical strength and viscoelastic response. Delamination and microvoid formation resulting from stresses caused by thermal and mechanical cycling effects are reduced or eliminated. As used herein, the term resin refers to all resins and epoxy resins, including modified epoxies, polyesters, polyurethanes, polyimides, polyesterimides, polyetherimides, bismaleimides, silicones, polysiloxanes, polybutadienes, cyanate esters, hydrocarbons etc. as well as homogeneous blends of these resins. This definition of resins includes additives such as cross-linking agents, accelerators and other catalysts and processing aids. Certain resins, such as liquid crystal thermosets (LCT) and 1,2 vinyl polybutadiene combine low molecular weights characteristics with good crosslinking properties. Further details on LCT resins can be found in U.S. Pat. No. 5,904,984, Smith, et. al., which is incorporated herein by reference. The resins can be of an organic matrix, such as hydrocarbons with and without hetero atoms, an inorganic matrix, containing silicate and/or alumino silicate components, and a mixture of an organic and inorganic matrix. Examples of an organic matrix include polymers or reactive thermosetting resins, which if required can react with the reactive groups introduced on inorganic particle surfaces. Cross-linking agents can also be added to the resins to manipulate the structure and segmental length distribution of the final crosslinked network, which can have a positive effect on thermal conductivity. This thermal conductivity enhancement can also be obtained through modifications by other resin additives, such as catalysts, accelerators and other processing aids. Reactive and non-reactive diluents may also be added.
Certain resins, such as liquid crystal thermosets (LCT) and 1,2 vinyl polybutadiene combine low molecular weights characteristics with good crosslinking properties. These types of resins tend to conduct heat better because of enhanced micro and macro ordering of their sub-structure which may lead to enhanced conduction of heat as a result of improved phonon transport. The better the phonon transport and the lower the phonon scattering the better the heat transfer.
These types of resins are referred to as highly structured (HS) resins, since they form highly organized micro-structures both prior to and during crosslinking when cured. The structures include crystallinity, para-crystallinity and liquid crystalline structures, unique polymer architectures, controlled crosslinking and network expansion and contraction during cure. The use of HS resins enhances the HTC properties, particularly to heat conductivity and can achieve significant enhancement of electrical and mechanical properties. In addition, the ordering of the HS resins can help to order/align the HTC fillers, which further enhances their physical properties, and can even increase both reactive covalent bonding and non-covalent bonding between the resin matrix and the fillers, because of lower steric hindrance between the resin matrix and the fillers.
Examples of particular types of HS resins fall into seven categories. The liquid crystal polymers discussed above, strained interpenetrating networks (IPNs), dendrimer molecules, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids.
The liquid crystal polymers are a special class of polymer that are typically aromatic polyesters that provide excellent physical properties such as high heat deflection while maintaining other physical characteristics. The liquid crystal polymer structures comprise densely packed, highly crystalline fibrous polymer chains that provide self-reinforcement, even almost up to the melting point of the polymer. Specific examples include Xydar™, which is biphenol based, Vectra™, which is naphthalene based and Zenite™ which is provided by DuPont™.
Interpenetrating Networks (IPN's) are materials containing two polymers, each in network form. Several kinds of IPN architectures exist, such as non-covalent semi-IPN, non-covalent full IPN and covalent semi-IPN. A non-covalent semi-IPN is one in which only one of the polymer systems is cross-linked. A non-covalent full IPN has two separate polymers independently cross-linked. A covalent semi-IPN contains two separate polymer systems that are cross-linked to form a single polymer network. A covalent semi-IPN is similar to a non-covalent IPN because one of the polymer systems can be crosslinked without networking with the second linear system. Thermalastic™ resins are examples of semi-IPN resins in which polystyrene chains are crosslinked with epoxy-anhydrides/polyesters. Organic-inorganic covalent IPN materials can incorporate silicon alkoxides along the backbone chain via free radical polymerization through a vinyl functional group or via condensation with an organic moiety on a silicon alkoxide monomer. These types of IPN can even interact with inorganic networks with inorganic fillers.
Structured organic-inorganic hybrids include the polyhedral oligomeric silsesquioxanes (POSS), tetraethyl orthosilicate (TEOS) and tetrabutyl orthotitanate (TBOT) and related monomeric and oligomeric hybrid compounds discussed above. Although not specifically illustrated in any of the figures, covalent bonds between the fillers and the host network are possible in some embodiments.
Dendrimer type matrices share similarities to the dendrimer fillers discussed herein, but form the host matrix rather than the filler. The dendrimer polymer comprises a core, and interior area containing many branches or repeating units, called generations, radially connected to the core, and an exterior region of terminal moieties. A dendrimer can be defined into a multitude of structures by fine tuning the architectural components. The surface of the dendrimer can be composed of a large number of functional groups which can be reacted with other polymer species to give unusual copolymer structures. These functional groups include amino, hydroxyl and carboxyl which would be reactive with resins such as the LCT epoxies. Specific types of dendrimers include polypropylene-imine, polyamido-amine, and polyamido-amines with an organic silicon exterior. These types of polymers can also form inorganic networks with the inclusion of inorganic fillers.
Expanding polymers are a class of highly strained cyclic monomers which have the ability to increase in volume as the highly strained cyclic ring opens to polymerize. So the polymer will expand as it cures and not shrink as most resins do. Total volume expansion can be 5-10%. The polymerization mechanism that gives ring opening can be anionic, cationic or free radical, therefore copolymers with epoxy resins and vinyl monomers containing resins are possibilities, due to the similarities of their reaction kinetics. Examples of expanding monomers include spiro, spiro ortho esters, spiro ortho carbonates, cyclic ketene acetals, cyclic vinyl ethers, unsaturated spiro ortho carbonates and unsaturated spiro ortho esters. The expansion phenomena during cure displayed by these types of materials benefits the addition of HTC fillers by causing higher internal compression at the microstructure level, causing increased particle contact, which increases thermal conductivity and electrical voltage endurance. In one embodiment there highly strained ring structures are present which are responsible for expansion combined with monomer units that are covalently linked to HTC fillers. Although many of the HS resins listed can be mixed with one another, the expanding polymers are particularly suited to be combined with the liquid crystal polymers.
Ladder polymers are highly structured polymers that consist of two main chains or backbones that bond together at regular intervals forming a ladder type structure. A polyimide made from a dianhydride and tetra-amine would be an example of this. Double-stranded ladders occur when a polymer in which the molecules consist of an uninterrupted sequence of rings with adjacent rings having one atom in common (spiro polymer) or two or more atoms in common (ladder polymer).
Star polymers are similar to dendrimers but differ in the way that they are synthesized and in their chemical structures. Star polymers are characterized by a high number of identical-size chains emerging out of a small core. The spherical shape of these polymers and the high order of branching gives star polymers unique properties, such as high compactness and segment density. An example of a particular star polymer would have a divinylbenzene core with polystyrene arm branches. Another example are methacrylate cores with polyethylene branches. The arm lengths can be controlled by the stoichiometric proportions of styrene and the initiator scheme, and the arm number is regulated by the stoichiometric quantity of divinylbenzene. Exemplary types of LS resins include bisphenol-A and bisphenol-F., epoxy-novolac, cycloaliphatic epoxy, hydantoin and aliphatic epoxies, which are compatible with and can be ordered by the HS resins.
As discussed above, the HS resins tend to aggregate on the molecular scale even when relatively thoroughly mixed with the LS resins. This results in a uniform dispersion of ordered regions throughout the mixed resin. Even without mechanical mixing, however, the HS and LS resins will mix to some extent if put in intimate contact, and order will be conferred into the LS resins.
For example, a HS layer may be placed on a surface, and then an LS layer placed on top of it. At the interface between the two layers, the resins will mix, and regions of order will extend into the LS layer. Techniques such as this can be used when normal mixing the two resins types is impractical or not desired.
A particular example of this is illustrated in
The two layers 52, 51 tend to be bonded together with a resin 55 such as a mica-bond. The entire tape is later impregnated with an impregnating resin, a typical one being Micalastic™ resin. The desired properties of the mica-bond are different than that of the Micalastic™. The mica bond resin is applied as a layer, while the Micalastic™ is impregnated into the tape. Therefore HS resins make a suitable mica-bond, while an LS is better as a Micalastic™. Once the LS/Micalastic™ resin has been impregnated, however, the two resins diffuse into one another, and a larger ordered region is created.
The HS can be oriented by the application of external fields of force. Examples of such fields are magnetic, electric and mechanical (AC/dynamic, DC/static, pulsed and combinations thereof), sonic and ultrasonic. For example, dielectrophoresis or electrophoresis may be used. The fields affect the resin molecules due to their dipole moment, but clusters also have a net dipole moment which the external fields will affect. Additionally, fluid flow fields can affect the orientation of the HS resins to distribute and structurally organize them. The flow field aligns the HS and pulls LS into alignment with it.
The resins may be used as bonding resins in a variety of industries such as circuit boards and insulating tapes. A particular kind of insulating tape is the mica-glass tape used in the electrical generator fields. Resins with these types of tapes can be used as bonding resins, or as impregnating resins as is known in the art. The resin may also be used in the electrical generator field without the tapes to fulfill electrical insulation applications in the rotating and static electrical equipment components.
In addition to the standard mica (Muscovite,Phlogopite) that is typically used for electrical insulation there is also Biotite mica as well as several other mica-like Alumino-Silicate materials such as Kaolinite, Halloysite, Montmorillonite and Chlorite. Montmorillonite has lattices in its structure which can be readily intercalated with polymer resins, metal cations and nano particles to give high dielectric strength composites.
The tapes may be impregnated with resin before or after being applied to electrical objects. Resin impregnation techniques include VPI and GVPI, discussed more below. In VPI, once a tape is lapped and impregnated it is compressed. Once in position, the resin in the compressed tape is cured, which effectively locks the position of the HTC materials. In some embodiments the resin is cured in a two stage process, as will be apparent to one of ordinary skill in the art. However, optimal compression of the loaded HTC materials favors a completely uncured resin during the compression stage.
In other embodiments, the present invention is used as a continuous coating on surfaces where insulation is desired; note that “continuous coating” is a description of a macro-scale application. In a continuous coating, the resin forms a coating on materials without the need for a tape or other substrate. When used with a substrate, the HTC materials can be combined with the resin by a variety of different methods. For example, they can be added prior to the resin being added to the substrate, or the HTC materials can be added to the substrate before the resin is impregnated thereon, or the resin can be added first, followed by the HTC material and then an additional impregnation of resin. Other fabrication and process methods will be apparent to one of ordinary skill in the art.
In one embodiment the present invention provides for a resin mixture that comprises a highly structured resin and a less structured resin. The highly structured resin and the less structured resins are mixed to a ratio typically of between 1:9 and 4:1 by volume, with a more particular ratio of 1:2 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form ordered structures.
In related embodiments, the ordered micro regions form continuous matrices within the resin mixture. In some embodiment cross-linking agents and/or HTC materials are added. In other related embodiment the HS resins are aligned by means of an external field and/or a flow field.
In another embodiment the present invention provides for a method of forming ordered regions within a resin mixture that comprises obtaining a highly structured resin and mixing the highly structured resin with a less structured resin, where the ratio of highly structured resin to less structured resin is from 1:9 to 4:1. The highly structured resin forms ordered regions and the ordered regions impose order on surrounding less structured resin molecules, and the ordered regions form continuous matrices within the resin mixture.
In particular embodiments the mixing is allowed to occur via diffusion, while in others the mixing is mechanical. In some embodiments the HS resin is put onto a material as a layer that the LS resin is impregnated into. Depending on when and how the LS resin is impregnated, the two resins may mix through diffusion, or the actual act of impregnation can provide the physical mixing process.
In still another embodiment the present invention provides for a method of creating a mixed resin matrix with ordered regions that comprises placing a layer of highly structured resin onto a material and impregnating into the material less structured resins. Then allowing the highly structured resin and the less structured resin to diffuse before curing. The highly structured resin forms ordered regions and the ordered micro regions impose order on surrounding less structured resin molecules.
The layer of highly structured resin absorbs at least partially into the material, and in some embodiments the material is a layer in a composite tape. On a composite tape, the layer may be placed at the mica-glass interface. In all cases HTC materials may be mixed in with the resin and/or the material.
While specific embodiments of the invention have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of the inventions which, is to be given the full breadth of the claims appended and any and all equivalents thereof.
Smith, James D. B., Stevens, Gary, Wood, John W.
| Patent | Priority | Assignee | Title |
| 11677282, | Feb 27 2020 | ACCELERATED SYSTEMS INC | Composite material for thermal management in an electric motor |
| 8383007, | Jun 14 2005 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
| 9879163, | Jun 06 2014 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
| 9911521, | Jun 06 2014 | General Electric Company | Curable composition for electrical machine, and associated method |
| 9928935, | May 31 2013 | GE Energy Power Conversion Technology Limited | Electrical insulation system |
| Patent | Priority | Assignee | Title |
| 3246271, | |||
| 3866316, | |||
| 3974302, | Nov 26 1974 | Westinghouse Electric Corporation | Method of making patterned dry resin coated sheet insulation |
| 4001616, | Feb 18 1974 | Canadian General Electric Company Limited | Grounding of outer winding insulation to cores in dynamoelectric machines |
| 4160926, | Jun 20 1975 | The Epoxylite Corporation | Materials and impregnating compositions for insulating electric machines |
| 4335367, | Aug 17 1979 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
| 4361661, | May 22 1980 | AT & T TECHNOLOGIES, INC , | Thermal backfill composition method |
| 4400226, | Jul 16 1981 | General Electric Company | Method of making an insulated electromagnetic coil |
| 4427740, | Apr 09 1982 | TECO HOLDINGS USA,INC | High maximum service temperature low cure temperature non-linear electrical grading coatings resistant to V.P.I. resins containing highly reactive components |
| 4634911, | Apr 16 1985 | WESTINGHOUSE ELECTRIC CORPORATION A CORP OF PA | High voltage dynamoelectric machine with selectively increased coil turn-to-turn insulation strength |
| 4694064, | Feb 28 1986 | DENDRITIC NANOTECHNOLOGIES INC | Rod-shaped dendrimer |
| 4704322, | Sep 22 1986 | ISOVOLTA, INC | Resin rich mica tape |
| 4760296, | Jul 30 1979 | General Electric Company | Corona-resistant insulation, electrical conductors covered therewith and dynamoelectric machines and transformers incorporating components of such insulated conductors |
| 4806806, | Sep 25 1987 | ASEA Aktiebolag | Coil for arrangement in slots in a stator or rotor of an electrical machine |
| 5011872, | Dec 21 1987 | Crystalline Materials Corporation | Thermally conductive ceramic/polymer composites |
| 5037876, | Apr 27 1989 | Qimonda AG | Planarizing dielectric |
| 5126192, | Jan 26 1990 | International Business Machines Corporation, | Flame retardant, low dielectric constant microsphere filled laminate |
| 5281388, | Mar 20 1992 | McDonnell Douglas Corporation | Resin impregnation process for producing a resin-fiber composite |
| 5466431, | May 03 1991 | NANODYNAMICS, INC | Diamond-like metallic nanocomposites |
| 5510174, | Jul 14 1993 | Parker Intangibles LLC | Thermally conductive materials containing titanium diboride filler |
| 5540969, | Dec 28 1992 | Alstom Technology Ltd | Insulating tape and method of producing it |
| 5578901, | Feb 14 1994 | Los Alamos National Security, LLC | Diamond fiber field emitters |
| 5723920, | Oct 12 1994 | General Electric Company | Stator bars internally graded with conductive binder tape |
| 5780119, | Mar 20 1996 | Southwest Research Institute | Treatments to reduce friction and wear on metal alloy components |
| 5801334, | Aug 24 1995 | VOITH SIEMENS HYDRO POWER INCORPORATED | Conductor (turn) insulation system for coils in high voltage machines |
| 5878620, | Jan 23 1997 | SCHLEGEL SYSTEMS, INC | Conductive fabric sensor for vehicle seats |
| 5904984, | Oct 17 1996 | SIEMENS ENERGY, INC | Electrical insulation using liquid crystal thermoset epoxy resins |
| 5938934, | Jan 13 1998 | Michigan Molecular Institute | Dendrimer-based nanoscopic sponges and metal composites |
| 5982056, | May 30 1996 | Hitachi, Ltd. | Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same |
| 6015597, | Nov 26 1997 | 3M Innovative Properties Company | Method for coating diamond-like networks onto particles |
| 6048919, | Jan 29 1999 | TICONA POLYMERS, INC | Thermally conductive composite material |
| 6103382, | Mar 14 1997 | SIEMENS ENERGY, INC | Catalyzed mica tapes for electrical insulation |
| 6130495, | May 15 1996 | Siemens Aktiengesellschaft | Supporting element for an electric winding, turbogenerator and method of producing a corona shield |
| 6130496, | Dec 18 1997 | Mitsubishi Denki Kabushiki Kaisha | Stator coil for rotary electric machine |
| 6140590, | May 16 1997 | Alstom | Stator winding insulation |
| 6160042, | May 01 1997 | General Electric Company | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
| 6190775, | Feb 24 2000 | SIEMENS ENERGY, INC | Enhanced dielectric strength mica tapes |
| 6238790, | May 26 1999 | SIEMENS ENERGY, INC | Superdielectric high voltage insulation for dynamoelectric machinery |
| 6255738, | Sep 30 1996 | TESSERA, INC , A CORPORATION OF DELAWARE | Encapsulant for microelectronic devices |
| 6261424, | May 30 1997 | Patinor AS | Method of forming diamond-like carbon coating in vacuum |
| 6261481, | Mar 19 1998 | Hitachi, LTD | Insulating composition |
| 6265068, | Nov 26 1997 | 3M Innovative Properties Company | Diamond-like carbon coatings on inorganic phosphors |
| 6288341, | Feb 27 1998 | MITSUBISHI HITACHI POWER SYSTEMS, LTD | Insulating material windings using same and a manufacturing method thereof |
| 6344271, | Nov 06 1998 | PPG Industries Ohio, Inc | Materials and products using nanostructured non-stoichiometric substances |
| 6359232, | Dec 19 1996 | General Electric Company | Electrical insulating material and stator bar formed therewith |
| 6393642, | Mar 14 1995 | Vicair B.V. | Supporting device such as for instance a cushion |
| 6396864, | Mar 13 1998 | JDS Uniphase Corporation; SDL, Inc | Thermally conductive coatings for light emitting devices |
| 6432537, | Dec 01 1995 | Triad National Security, LLC | Diamond-like-carbon coated aramid fibers having improved mechanical properties |
| 6504102, | Feb 27 1998 | MITSUBISHI HITACHI POWER SYSTEMS, LTD | Insulating material, windings using same, and a manufacturing method thereof |
| 6506331, | Feb 29 2000 | Shin-Etsu Chemical Co., Ltd. | Method for the preparation of low specific gravity silicone rubber elastomers |
| 6509063, | Feb 26 1998 | Honeywell International Inc. | Preparation of polyindanebisphenols and polymers derived therefrom |
| 6548172, | Nov 26 1997 | 3M Innovative Properties Company | Diamond-like carbon coatings on inorganic phosphors |
| 6572937, | Nov 30 1999 | Los Alamos National Security, LLC | Method for producing fluorinated diamond-like carbon films |
| 6632561, | Nov 04 1998 | BASF Aktiengesellschaft | Composites bodies used as separators in electrochemical cells |
| 6635720, | Feb 16 1999 | DENDRITIC NANOTECHNOLOGIES INC | Core-shell tectodendrimers |
| 6746758, | Aug 27 1999 | MITSUBISHI HITACHI POWER SYSTEMS, LTD | Insulating material and electric machine winding and method for manufacturing the same |
| 6821672, | Sep 02 1997 | Hollingsworth & Vose Company | Mat of glass and other fibers and method for producing it |
| 6882094, | Feb 16 2000 | ATS MER, LLC | Diamond/diamond-like carbon coated nanotube structures for efficient electron field emission |
| 6905655, | Mar 15 2002 | Nanomix, Inc.; NANOMIX, INC | Modification of selectivity for sensing for nanostructure device arrays |
| 6974627, | Sep 20 2001 | Showa Denko K K; National Institute of Advanced Industrial Science and Technology | Fine carbon fiber mixture and composition thereof |
| 7033670, | Jul 11 2003 | SIEMENS ENERGY, INC | LCT-epoxy polymers with HTC-oligomers and method for making the same |
| 7042346, | Aug 12 2003 | Radio frequency identification parts verification system and method for using same | |
| 7120993, | Jun 11 2003 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing insulated coil |
| 7180409, | Mar 11 2005 | Continental Automotive Systems, Inc | Tire tread wear sensor system |
| 7189778, | Jul 22 2002 | Polymatech Co., Ltd. | Thermally conductive polymer molded article and method for producing the same |
| 7425366, | Jan 15 2004 | Kabushiki Kaisha Toshiba | Tape member or sheet member, and method of producing tape member or sheet member |
| 20020058140, | |||
| 20020070621, | |||
| 20020098285, | |||
| 20030035960, | |||
| 20030040563, | |||
| 20040094325, | |||
| 20040152829, | |||
| 20040241439, | |||
| 20050097726, | |||
| 20050116336, | |||
| 20050161210, | |||
| 20050208301, | |||
| 20050236606, | |||
| 20050245644, | |||
| 20050274450, | |||
| 20050274540, | |||
| 20050274774, | |||
| 20050277350, | |||
| 20050277351, | |||
| 20050277721, | |||
| 20052077349, | |||
| 20060034787, | |||
| 20060142471, | |||
| 20060231201, | |||
| 20060234027, | |||
| 20060234576, | |||
| 20060258791, | |||
| 20060280873, | |||
| 20060281380, | |||
| 20060281833, | |||
| 20070026221, | |||
| 20070114704, | |||
| 20070141324, | |||
| 20080050580, | |||
| 20080066942, | |||
| 20080262128, | |||
| EP157936, | |||
| EP266602, | |||
| EP394767, | |||
| EP604804, | |||
| EP1220240, | |||
| EP1300439, | |||
| EP1383226, | |||
| EP1384567, | |||
| EP1486997, | |||
| EP1530223, | |||
| GB881036, | |||
| JP10088201, | |||
| JP10211659, | |||
| JP2002212422, | |||
| JP200506389, | |||
| JP2005199562, | |||
| JP3205443, | |||
| JP56029305, | |||
| JP6313267, | |||
| WO2006007385, | |||
| WO56127, | |||
| WO168749, | |||
| WO184659, | |||
| WO3040445, | |||
| WO2004006271, | |||
| WO2004052999, | |||
| WO2004067606, | |||
| WO2005069312, | |||
| WO2005106089, | |||
| WO2005123825, | |||
| WO2005124790, | |||
| WO2006002014, | |||
| WO9502504, | |||
| WO9628073, | |||
| WO9841993, | |||
| WO9926286, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 27 2006 | SMITH, JAMES D B | SIEMENS POWER GENERATION, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017754 | /0886 | |
| Mar 27 2006 | WOOD, JOHN W | SIEMENS POWER GENERATION, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017754 | /0886 | |
| Mar 31 2006 | SURREY, UNIVERSITY OF | SIEMENS POWER GENERATION, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017754 | /0886 | |
| Apr 03 2006 | Siemens Energy, Inc. | (assignment on the face of the patent) | / | |||
| Apr 03 2006 | STEVENS, GARY | SIEMENS POWER GENERATION, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017754 | /0886 | |
| Oct 01 2008 | SIEMENS POWER GENERATION, INC | SIEMENS ENERGY, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 022488 | /0630 |
| Date | Maintenance Fee Events |
| Jan 22 2014 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
| Apr 09 2018 | REM: Maintenance Fee Reminder Mailed. |
| Oct 01 2018 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
| Date | Maintenance Schedule |
| Aug 24 2013 | 4 years fee payment window open |
| Feb 24 2014 | 6 months grace period start (w surcharge) |
| Aug 24 2014 | patent expiry (for year 4) |
| Aug 24 2016 | 2 years to revive unintentionally abandoned end. (for year 4) |
| Aug 24 2017 | 8 years fee payment window open |
| Feb 24 2018 | 6 months grace period start (w surcharge) |
| Aug 24 2018 | patent expiry (for year 8) |
| Aug 24 2020 | 2 years to revive unintentionally abandoned end. (for year 8) |
| Aug 24 2021 | 12 years fee payment window open |
| Feb 24 2022 | 6 months grace period start (w surcharge) |
| Aug 24 2022 | patent expiry (for year 12) |
| Aug 24 2024 | 2 years to revive unintentionally abandoned end. (for year 12) |