Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
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11. An apparatus comprising:
a support including a support surface and a support bond pad on the support surface;
a first die disposed on the support, the first die including a die surface and a die bond pad on the die surface;
a second die arranged in a stack with the first die;
a dielectric located outside the first die and the second die, the dielectric including a via and groove combination coupled to the die bond pad and the support bond pad; and
a connection coupled to the die bond pad and the support bond pad, wherein connection includes at least one conductive segment in the via and groove combination, and the first die and the second die include a controller that includes a communication module for wireless communication
a third die arranged in a stack with the first die and the second die.
12. An apparatus comprising:
a support including a support surface and a support bond pad on the support surface;
a first die disposed on the support, the first die including a die surface and a die bond pad on the die surface;
a second die arranged in a stack with the first die;
a dielectric located outside the first die and the second die, the dielectric including a via and move combination coupled to the die bond ad and the support bond pad; and
a connection coupled to the die bond pad and the support bond pad, wherein connection includes at least one conductive segment in the via and groove combination, and the first die and the second die include a controller that includes a communication module for wireless communication, wherein the via and groove combination includes:
a first via in the dielectric and over the die bond pad of the first die;
a second via in the dielectric and over the support bond pad; and
a groove in the dielectric and bridging the first via and the second via.
9. An apparatus comprising:
a support including a support surface and a support bond pad on the support surface;
a first die disposed on the support, the first die including a first die surface and a first die bond pad on the first die surface;
a second die arranged in a stack with the first die, the second die including a second die surface and a second die bond pad on the second die surface;
a dielectric located outside the first die and the second die, the dielectric including a via and groove combination coupled to the first die bond pad, the second die bond pad, and the support bond pad; and
a connection including conductive segments formed in the via and groove combination and coupled the first die bond pad, the second die bond pad, and the support bond pad, wherein the via and groove combination includes:
a first via in the dielectric and over the first die bond pad;
a second via in the dielectric and over second die bond pad; and
a third via in the dielectric and over support bond pad.
1. An apparatus comprising:
a support including a support surface and a support bond pad on the support surface;
a first die including a die surface and a die bond pad on the die surface;
a dielectric located outside the die and outside the support, the dielectric including a first via formed in the dielectric and a second via formed in the dielectric;
a connection coupled to the die bond pad and the support bond pad, the connection including a first conductive segment formed in the first via and contacting the die bond pad, and a second conductive segment formed in the second via and contacting the support bond pad;
a second die over the support, the second die including a die surface and a second die bond pad on the die surface, wherein dielectric includes a third via and the connection includes a third conductive segment formed in the third via and contacting the second die bond pad; and
a third die over the support, the third die including a die surface and a third die bond pad on the die surface, wherein the dielectric includes a fourth via, and the connection includes a fourth conductive segment in the fourth via and contacting the third die bond pad.
2. The apparatus of
3. The apparatus of
4. The apparatus of
5. The apparatus of
6. The apparatus of
7. The apparatus of
8. The apparatus of
10. The apparatus of
13. The apparatus of
a first conductive segment in the first via and contacting the bond pad of the first die; and
a second conductive segment in the second via and contacting the support bond pad.
14. The apparatus of
15. The apparatus of
a first conductive segment in the first via and contacting the bond pad of the first die;
a second conductive segment in the second via and contacting the support bond pad; and
a third conductive segment in the third via and contacting the bond pad of the second die.
16. The apparatus of
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This application is a continuation of U.S. application Ser. No. 14/658,743, filed Mar. 16, 2015, which is a continuation of U.S. application Ser. No. 13/970,241, filed Aug. 19, 2013, now issued as U.S. Pat. No. 8,981,573, which is a continuation of U.S. application Ser. No. 13/335,825, filed Dec. 22, 2011, now issued as U.S. Pat. No. 8,513,108, which is a divisional of U.S. application Ser. No. 12/305,965, filed Feb. 24, 2009, now issued as U.S. Pat. No. 8,084,867, which is a U.S. National Stage Filing under 35 U.S.C. 371 from International Patent Application Serial No. PCT/CN2006/001507, filed Jun. 29, 2006, and published on Feb. 7, 2008 as WO 2008/014633 A1, all of which are incorporated herein by reference in their entirety.
Embodiments of the present invention relate to integrated circuit packaging, and particularly to wiring connections in integrated circuit packages.
Computers and electronic devices usually include an integrated circuit (IC) package. The IC package may often have a die mounted on a base or support of the IC package. The die may include a circuit for performing an electrical function.
Some IC packages have gold or copper wires coupled between the die and the support to allow electrical signal to be transferred to and from the circuit in the die.
In some cases, too many wires may cause undesirable signal interference, raise wiring material cost, increase package size to protect the wires, increase the chance of short circuit among the wires, and may complicate manufacturing process.
For clarity, some features described herein (e.g., die 101 in
As show in
As shown in
In the processes described in
As described in
As described in
The processes described in
Processor 1610 may be a general-purpose processor or an application specific integrated circuit (ASIC). Memory device 1620 may be a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a flash memory device, or a combination of these memory devices. I/O controller 1650 may include a communication module for wired or wireless communication. One or more or the components shown in system 1600 may include an apparatus such as apparatus 100, 400, 500, or 1400 of
System 1600 may include computers (e.g., desktops, laptops, hand-helds, servers, Web appliances, routers, etc.), wireless communication devices (e.g., cellular phones, cordless phones, pagers, personal digital assistants, etc.), computer-related peripherals (e.g., printers, scanners, monitors, etc.), entertainment devices (e.g., televisions, radios, stereos, tape and compact disc players, video cassette recorders, camcorders, digital cameras, MP3 (Motion Picture Experts Group, Audio Layer 3) players, video games, watches, etc.), and the like.
The above description and the drawings illustrate some specific embodiments of the invention sufficiently to enable those skilled in the art to practice the embodiments of the invention. Other embodiments may incorporate structural, logical, electrical, process, and other changes. In the drawings, like features or like numerals describe substantially similar features throughout the several views. Examples merely typify possible variations. Portions and features of some embodiments may be included in, or substituted for, those of others. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. Therefore, the scope of various embodiments is determined by the appended claims, along with the full range of equivalents to which such claims are entitled.
Sakamoto, Shinichi, Tang, Jiamiao, Xu, Henry
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