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The ornamental design for an ultrasonic wave thickness meter, as shown and described. |
FIG. 1 is a front elevational view of an ultrasonic wave thickness meter showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
Tamura, Minoru, Ito, Kazuyuki, Kitada, Toyohiko, Iiyama, Kunio, Arioka, Takanori
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 05 1978 | Tokyo Keiki Company Limited | (assignment on the face of the patent) | / |
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