Heat releasing plate for mounting semiconductor components

The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.

FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a right side view thereof; and

FIG. 4 is a sectional view taken on line 4--4 of FIG. 1.

Patent	Priority	Assignee	Title
D846513,	Apr 27 2016	NGK Insulators, Ltd.	Sheet heater for electrostatic chuck

Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
May 30 1980		Showa Aluminum Kabushiki Kaisha	(assignment on the face of the patent)

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