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Patent
   D268666
Priority
May 18 1981
Filed
May 18 1981
Issued
Apr 19 1983
Expiry
Apr 19 1997
Inventors
Moore, Mar…
Assg.orig
Thermalloy…
Assg.curr
Thermalloy…
Entity
unknown
Referenced by
4
References
4
Maint.:
n/a
The ornamental design for a heat sink or similar article, substantially as shown.

FIG. 1 is a top plan view of a heat sink or similar article showing my new design;

FIG. 2 is a side elevational view thereof; and

FIG. 3 is a bottom plan view of the heat sink or similar article of my invention.
INVENTORS:

Moore, Marvin F.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
6633485, Nov 20 2002 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
D616381, Jun 18 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
D822625, Apr 26 2016 Resonac Corporation Fin for heat exchanger
D987167, Mar 23 2020 Osram GmbH Heatsink for a lamp
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
2838740,
2879977,
3033537,
GB1071431,
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 24 1981MOORE MARVIN F Thermalloy IncorporatedASSIGNMENT OF ASSIGNORS INTEREST 0038900031 pdf
May 18 1981Thermalloy Incorporated(assignment on the face of the patent)
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
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