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Patent
D616381
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Priority
Jun 18 2009
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Filed
Sep 29 2009
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Issued
May 25 2010
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Expiry
May 25 2024
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Assg.orig
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Entity
unknown
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4
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9
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n/a
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The ornamental design for a heat dissipation device, as shown and described.
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FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof wherein the broken lines are shown for illustrative purpose only and forms no part of the claimed design.
Lin, Shan-Ju, Chang, Hsueh-Chen
Patent |
Priority |
Assignee |
Title |
4918571, |
Mar 31 1987 |
AMP Incorporated |
Chip carrier with energy storage means |
5579827, |
Nov 13 1995 |
US Micro Lab, Inc. |
Heat sink arrangement for central processing unit |
5708564, |
May 07 1996 |
|
Heat sink mounting structure |
5825622, |
May 17 1997 |
Tyco Electronics Logistics AG |
Heat sink assembly with adjustable mounting clip |
6550531, |
May 16 2000 |
Intel Corporation |
Vapor chamber active heat sink |
7172017, |
Jul 16 2002 |
Delta Electronics, Inc. |
Heat sink |
D268666, |
May 18 1981 |
Thermalloy Incorporated |
Heat sink or similar article |
D298458, |
Apr 03 1986 |
|
Thermoelectric device for heating and cooling the skin |
D592614, |
Jun 18 2008 |
4187318 CANADA INC |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a