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Patent
D592614
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Priority
Jun 18 2008
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Filed
Jun 18 2008
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Issued
May 19 2009
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Expiry
May 19 2023
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Assg.orig
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Entity
unknown
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2
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9
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of a first heat sink of the present design;
FIG. 2 is a bottom view of the heat sink of FIG. 1;
FIG. 3 is a top view of the heat sink of FIG. 1;
FIG. 4 is a right side view of the heat sink of FIG. 1, the left side view of the heat sink of FIG. 1 being a mirror image thereof;
FIG. 5 is a front view of the heat sink of FIG. 1, the rear view of the heat sink of FIG. 1 being identical thereto;
FIG. 6 is a perspective view of a second heat sink of the present design;
FIG. 7 is a bottom view of the heat sink of FIG. 6;
FIG. 8 is a top view of the heat sink of FIG. 6;
FIG. 9 is a right side view of the heat sink of FIG. 6, the left side view of the heat sink of FIG. 6 being a mirror image thereof; and,
FIG. 10 is a front view of the heat sink of FIG. 6, the rear view of the heat sink of FIG. 6 being identical thereto.
Any parts shown in broken lines form no part of the claimed design.
Plonski, Eran, Kumar, Sharath, Baqui, Eihab
Patent |
Priority |
Assignee |
Title |
4823869, |
Jun 19 1986 |
International Business Machines Corporation |
Heat sink |
5726495, |
Mar 09 1992 |
Sumitomo Metal Industries, Ltd. |
Heat sink having good heat dissipating characteristics |
6175499, |
Mar 09 1998 |
International Business Machines Corporation |
Heat sink clamping string additionally holding a ZIF socket locked |
6741470, |
Jun 01 2001 |
BEIJING XIAOMI MOBILE SOFTWARE CO , LTD |
Reusable thermal solution attachment mechanism and methods of using same |
6829144, |
Aug 05 2003 |
International Business Machines Corporation |
Flip chip package with heat spreader allowing multiple heat sink attachment |
20020185269, |
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20030103332, |
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20030192672, |
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D398295, |
Oct 08 1996 |
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Heat dissipating plate for computer parts |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a