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The ornamental design for combined integrated circuit package carrier and socket, as shown and described. |
FIG. 1 is a top plan view of combined integrated circuit package carrier and socket, showing our new design.
FIG. 2 is a left side elevational view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a right side elevational view thereof.
FIG. 5 is a front elevational view thereof.
FIG. 6 is a rear elevational view thereof.
FIG. 7 is an isometric view thereof looking generally downward.
FIG. 8 is an isometric view thereof on a reduced scale looking generally upward.
Jones, James C., Emerson, James A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 02 1980 | JONES JAMES C | ROBINSON NUGENT, INC , A CORP OF IN | ASSIGNMENT OF ASSIGNORS INTEREST | 003865 | /0496 | |
Mar 02 1980 | EMERSON JAMES A | ROBINSON NUGENT, INC , A CORP OF IN | ASSIGNMENT OF ASSIGNORS INTEREST | 003865 | /0496 | |
Feb 23 1981 | Robinson-Nugent, Inc. | (assignment on the face of the patent) | / |
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