Patent
   D571297
Priority
Sep 12 2006
Filed
Mar 08 2007
Issued
Jun 17 2008
Expiry
Jun 17 2022
Assg.orig
Entity
unknown
3
8
n/a
The ornamental design for a connector, as shown and described.

FIG. 1 is a front elevation view of a connector showing my new design.

FIG. 2 is a back elevation view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevation view thereof, the left side elevation view being a mirror image thereof;

FIG. 6 is an enlarged cross-sectional view thereof, taken along line 66 of FIG. 4.

FIG. 7 is an enlarged cross-sectional view thereof, in use condition.

FIG. 8 is a partially enlarged view of area 8 of FIG. 4.

FIG. 9 is a top, front, and right side perspective view thereof, showing a state before connection to a mating connector; and,

FIG. 10 is a top, front, and right side perspective view thereof.

The broken line showing of the environment structures in FIGS. 7 and 9 is for illustration purposes only and form no part of the claimed design.

Nagata, Takayuki

Patent Priority Assignee Title
D591241, Jan 23 2007 Hon Hai Precision Ind. Co., Ltd. Electrical connector
D591684, Jul 12 2007 Hon Hai Precision Ind. Co., Ltd. Electrical connector
D598379, Apr 30 2008 Hon Hai Precision Ind. Co., Ltd. Electrical connector
Patent Priority Assignee Title
20060068624,
D271296, Feb 23 1981 Robinson-Nugent, Inc. Combined integrated circuit package carrier and socket
D292699, Oct 19 1984 Nortel Networks Limited Dual male pin connector
D444130, Sep 09 1999 Japan Aviation Electronics Industry Limited Electric connector
D455400, Jan 28 2000 Japan Aviation Electronics Industry, Limited Electrical connector
D495997, Aug 02 2002 Japan Aviation Electronics Industry, Limited Electrical connector
D537043, May 09 2005 Hosiden Corporation Connector
D537415, May 09 2005 Hosiden Corporation Connector
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Jan 26 2007NAGATA, TAKAYUKIHosiden CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0190760519 pdf
Mar 08 2007Hosiden Corporation(assignment on the face of the patent)
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