Patent
   D276719
Priority
Jan 14 1982
Filed
Jul 12 1982
Issued
Dec 11 1984
Expiry
Dec 11 1998
Assg.orig
Entity
unknown
3
6
n/a
The ornamental design for an integrated circuit device, as shown.

FIG. 1 is a bottom plan view of an integrated circuit device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a perspective view thereof; and

FIG. 8 is a sectional view taken along line A--A of FIG. 2.

Sugimoto, Masahiro, Wakabayashi, Tetsushi, Akasaki, Hidehiko

Patent Priority Assignee Title
D342721, Mar 04 1992 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
D356067, Mar 04 1992 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
D712854, Apr 26 2013 NOK Corporation Integrated circuit tag
Patent Priority Assignee Title
2879977,
3241605,
3808475,
3872583,
236833,
GB2091036,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 05 1982SUGIMOTO, MASAHIROFUJITSU LIMITED, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0040340904 pdf
Jul 05 1982AKASAKI, HIDEHIKOFUJITSU LIMITED, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0040340904 pdf
Jul 05 1982WAKABAYASHI, TETSUSHIFUJITSU LIMITED, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0040340904 pdf
Jul 12 1982Fujitsu Limited(assignment on the face of the patent)
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