Heat dissipating device for a semiconductor package

Abstract

Description

FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2; and,

FIG. 7 is the same view as in FIG. 4 showing the heat dissipating device attached to a semiconductor package shown in broken lines since the packages do not form any part of the claimed design.

Claims

The ornamental design for a heat dissipating device for a semiconductor package, as shown and described.