Patent
   D277748
Priority
Sep 30 1982
Filed
Sep 30 1982
Issued
Feb 26 1985
Expiry
Feb 26 1999
Assg.orig
Entity
unknown
8
1
n/a
The ornamental design for a pinned-extrusion heat sink for electronic devices, substantially as shown.

FIG. 1 is a perspective view of a pinned-extrusion heat sink for electronic devices showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

McCarthy, Alfred F.

Patent Priority Assignee Title
6633485, Nov 20 2002 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
D400188, May 22 1997 Hon Hai Precision Ind. Co., Ltd. Heat sink
D406112, Mar 20 1998 DSC Communications Corporation Heat sink
D450044, Jun 14 2000 Cooler for heat dissipation
D693316, May 13 2011 SAPA Profiler AB Air cooler
D698740, May 23 2012 Alpoint Technologies, LLC Heat sink
D936622, Jan 17 2019 Telefonaktiebolaget LM Ericsson (publ) Baffle for heat sink
D953280, Jan 17 2020 Furukawa Electric Co., Ltd Heat sink
Patent Priority Assignee Title
200775,
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Sep 20 1982MC CARTHY, ALFRED F AAVID ENGINEERING, INC , LACONIA, NEW HAMPSHIRE, A NEW HAMPSHIRE CORP ASSIGNMENT OF ASSIGNORS INTEREST 0043050650 pdf
Sep 30 1982Aavid Engineering, Inc.(assignment on the face of the patent)
May 12 1988AAVID ENGINEERING, INC , A NH CORP MNC COMMERCIAL CORPSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0052430024 pdf
May 12 1988AAVID ENGINEERING, INC , A N H CORP MNC COMMERCIAL CORP , A MD CORP SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0052430045 pdf
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